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Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs)

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Abstract

Photo-active anisotropic conductive films (PA-ACFs) with curing temperatures below 120°C were introduced using photo-active curing agents. The PA-ACFs showed no curing before UV activation, and the crosslinking systems of the PA-ACFs were not activated under fluorescent light exposure. However, after UV activation, the PA-ACFs were completely cured at 120°C within 10 s. Flex-on-board (FOB) assembly using PA-ACFs had adhesion strength and joint resistances similar to those of the FOB assemblies using conventional epoxy-based ACFs. This study demonstrates that PA-ACFs provide reliable interconnection and minimal thermal deformation among all the commercially available ACFs, especially for low T g substrate applications.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, South Korea

    Il Kim & Kyung-Wook Paik

Authors
  1. Il Kim
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  2. Kyung-Wook Paik
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Correspondence to Kyung-Wook Paik.

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Kim, I., Paik, KW. Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs). J. Electron. Mater. 43, 3236–3242 (2014). https://doi.org/10.1007/s11664-014-3209-z

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  • DOI: https://doi.org/10.1007/s11664-014-3209-z

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