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Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction

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Abstract

The effects of Y2O3 nanoparticles doped in Sn-3Ag-0.5Cu solder on the growth behaviors of Cu6Sn5 grains in the soldering reaction with copper were investigated. It is found that the growth rate of Cu6Sn5 grains was markedly decreased due to the addition of Y2O3 nanoparticles. The statistical size distribution results indicated that Cu6Sn5 grains with radius less than the average value account for a high percentage. These results confirm that the nanoparticles can effectively suppress the diffusion behaviors of Cu atoms in the wetting reaction.

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Acknowledgements

The authors would like to thank Q.K. Zhang for his help in the experiments. This research was financially supported by the National Basic Research Program of China under Grant No. 2010CB631006.

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Authors and Affiliations

  1. University of Science and Technology of China, 96 JinZhai Road, Hefei, 230026, China

    L. M. Yang

  2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, 72 Wenhua Road, Shenyang, 110016, China

    L. M. Yang & Z. F. Zhang

  3. Department of Physics, Shenyang University of Technology, 111 Shenliaoxi Road, Shenyang, 110870, China

    L. M. Yang

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  1. L. M. Yang
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  2. Z. F. Zhang
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Correspondence to L. M. Yang.

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Yang, L.M., Zhang, Z.F. Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction. J. Electron. Mater. 42, 3552–3558 (2013). https://doi.org/10.1007/s11664-013-2817-3

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  • DOI: https://doi.org/10.1007/s11664-013-2817-3

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