Abstract
The electrical properties of a fabricated Au/polymethylmethacrylate (PMMA)/n-InP Schottky barrier diode have been analyzed for different annealing temperatures using current–voltage (I–V) and capacitance–voltage (C–V) techniques. It is observed that the Au/PMMA/n-InP structure shows excellent rectifying behavior. The extracted barrier height and ideality factor of the as-deposited Au/PMMA/n-InP Schottky contact are 0.68 eV (J–V)/0.82 eV (C–V) and 1.57, respectively. However, the barrier height (BH) of the Au/PMMA/n-InP Schottky contact increases to 0.78 eV (J–V)/0.99 eV (C–V) when the contact is annealed at 150°C for 1 min in nitrogen atmosphere. Upon annealing at 200°C, the BH value decreases to 0.72 eV (J–V)/0.90 eV (C–V) and the ideality factor increases to 1.48. The PMMA layer increases the effective barrier height of the structure by creating a physical barrier between the Au metal and the n-InP. Cheung’s functions are also used to calculate the series resistance of the Au/PMMA/n-InP structure. The interface state density (N ss) is found to be 6.380 × 1012 cm−2 eV−1 and 1.916 × 1012 cm−2 eV−1 for the as-deposited and 150°C-annealed Au/PMMA/n-InP Schottky contacts, respectively. These results indicate that the interface state density and series resistance have a significant effect on the electrical characteristics of Au/PMMA/n-InP Schottky barrier devices. Finally, it is noted that the diode parameters change with increasing annealing temperature.
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T.-F. Lei, W.-C. Huang, and C.-L. Lee, J. Appl. Phys. 78, 1 (1995).
Zs.J. Horvath, V. Rakovics, B. Szentpali, and S. Puspoki, Phys. Status Solidi C 0, 916 (2003).
P.G. McCafferty, A. Sellai, P. Dawson, and H. Elabd, Solid State Electron. 39, 583 (1996).
N. Newman, T. Kendelwicz, L. Bowman, and W.E. Spicer, Appl. Phys. Lett. 46, 1176 (1985).
Zs.J. Horvath, V. Rakovics, B. Szentpali, S. Puspoki, and K.Z. Ydansky, Vacuum 71, 113 (2003).
H. Cetin and E. Ayyildiz, Semicond. Sci. Technol. 20, 625 (2005).
O. Gullu, O. Baris, M. Biber, and A. Turut, Appl. Surf. Sci. 254, 3039 (2008).
M.D. Aydin and F. Yakuphanoglu, J. Phys. Chem. Solids 68, 1770 (2007).
M. El-Sayed, H.M.A. Hamid, and R.M. Radwan, Radiat. Phys. Chem. 69, 339 (2004).
C. Van Nguyan and K. Pote Kamloth, J. Phys. D Appl. Phys. 33, 2230 (2000).
M.M. El-Nahass, K.F. Abd-El-Rahman, A.A.M. Farag, and A.A.A. Darwish, Org. Electron. 6, 129 (2005).
S. Aydogan, M. Saglam, and A. Turut, Vacuum 77, 269 (2005).
M. Cakar, N. Yildirim, S. Karatas, C. Temirci, and A. Turut, J. Appl. Phys. 100, 074505 (2006).
A.R. Vearey Roberts and D.A. Evans, Appl. Phys. Lett. 86, 072105 (2005).
O. Gullu, Microelectron. Eng. 87, 648 (2010).
M.C. Lorengan, Science 278, 2103 (1997).
F.E. Jones, B.P. Wood, J.A. Myers, C.D. Hafar, and M.C. Lorengan, J. Appl. Phys. 86, 6431 (1999).
S. Angappane, N. Rajeev Kini, T.S. Natarajan, G. Rangarajan, and B. Wessling, Thin Solid Films 41, 7202 (2002).
O. Gullu, A. Turut, and S. Asubay, J. Phys. Condens. Mater. 20, 045215 (2008).
O. Gullu and A. Turut, J. Vac. Sci. Technol., B 28, 466 (2010).
M. Soylu, B. Abay, and Y. Onganer, J. Phys. Chem. Solids 71, 1398 (2010).
A.A.M. Farag and I.S. Yahia, Synth. Met. 161, 32 (2011).
A. Ashok Kumar, K.S. Shin, V. Rajagopal Reddy, C.J. Choi, V. Janardhanam, M.W. Seo, and H. Hong, J. Electrochem. Soc. 159, H33 (2012).
V. Rajagopal Reddy, M. Siva Pratap Reddy, A. Ashok Kumar, and C.J. Choi, Thin Solid Films 520, 5715 (2012).
N. Koch, ChemPhysChem 8, 1438 (2007).
R. Poddar and C. Luo, Solid State Electron. 50, 1648 (2006).
W. Wang and E.A. Schiff, Appl. Phys. Lett. 91, 133504 (2007).
S. Gunes, H. Neugebauer, and N.S. Saricifici, Chem. Rev. 107, 1324 (2007).
S.J. Kim, W.J. Kim, A.N. Cartwright, and P.N. Prasad, Sol. Energ. Mater. Sol. C. 93, 657 (2009).
R. Sivakumar, K. Akila, and S. Anandan, Curr. Appl. Phys. 10, 1255 (2010).
J.M.G. Larajeria, H.J. Khoury, D.M. De Azevedo, E.F. Da Silva, and E.A. De Vasconcelos, Appl. Surf. Sci. 190, 390 (2002).
M.N. Kozicki, M. Park, and M. Mitkova, Non-Volatile Memory Technology Symp. (Orlando, FL: NVMTS, 2004), Proc. 2004, 10 (2004).
R.H. Williams and G.Y. Robinson, Physics and Chemistry of III-V Compound Semiconductor Interfaces (New York: Plenum, 1985).
N. Szydlo and J. Oliver, J. Appl. Phys. 50, 1445 (1979).
Z. Benamara, B. Akkal, A. Talbi, B. Gruzza, and L. Bideux, Mater. Sci. Eng. C 21, 287 (2002).
Z.Q. Shi, R. Wallace, and W.A. Anderson, Appl. Phys. Lett. 59, 446 (1991).
N.G. Semaltianos, Microelectron. J. 38, 754 (2007).
U.T. Kampen, S. Park, and D.R.T. Zahn, Appl. Surf. Sci. 190, 461 (2002).
D.R.T. Zahn, T.U. Kampen, and H. Mendez, Appl. Surf. Sci. 423, 212 (2003).
S. Aydogan, M. Saglam, and A. Turut, Microelectron. Eng. 85, 278 (2008).
A. Turut, M. Saglam, H. Efeoglu, N. Yalcin, M. Yildirim, and B. Abay, Phys. B 205, 41 (1995).
S.K. Cheung and N.W. Cheung, Appl. Phys. Lett. 49, 85 (1986).
H. Norde, J. Appl. Phys. 50, 5052 (1979).
S. Aydogan, M. Saglam, and A. Turut, Polymers 45, 563 (2005).
A.F. Ozdemir, A. Turut, and A. Kokce, Thin Solid Films 425, 210 (2003).
A.A.M. Farag, I.S. Yalia, and M. Fadel, Int. J. Hydrogen Energ. 34, 4906 (2009).
A.M. Goodman, J. Appl. Phys. 34, 329 (1963).
S.M. Sze, Physics of Semiconductor Devices (New York: Wiley-Interscience, 1981), p. 279.
A.M. Cowley, J. Appl. Phys. 34, 3024 (1966).
M. Soylu and B. Abay, Microelectron. Eng. 86, 88 (2009).
H. Korkut, N. Yildirim, and A. Turut, Microelectron. Eng. 86, 111 (2009).
A. Turut, B. Bati, A. Kokce, M. Saglam, and N. Yalcin, Phys. Scripta 53, 118 (1996).
H.C. Card and E.H. Rhoderick, J. Phys. D Appl. Phys. 4, 1589 (1971).
S. Pandey and S. Kal, Solid State Electron. 42, 943 (1998).
J.Y. Duboz, F. Binet, N. Laurent, E. Rosencher, F. Scholz, V. Harle, O. Briot, B. Gil, and R.L. Aulombard, Mater. Res. Soc. Sym. Proc. 449, 1085 (1996).
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Rajagopal Reddy, V., Umapathi, A. & Sankar Naik, S. Influence of Annealing on Electrical Properties of an Organic Thin Layer-Based n-Type InP Schottky Barrier Diode. J. Electron. Mater. 42, 1282–1289 (2013). https://doi.org/10.1007/s11664-013-2592-1
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DOI: https://doi.org/10.1007/s11664-013-2592-1