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Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires

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Abstract

An innovative Ag-8Au-3Pd bonding wire with a high twin density has been produced. The grain size of this annealing-twinned wire changes moderately during electrical stressing, unlike that of the conventional grained wire, which increases drastically and even leads to a bamboo structure. In addition, the durability against electromigration of the annealing-twinned Ag-8Au-3Pd alloy wire is higher than that of the conventional grained wire. This higher durability can be ascribed to the surface reconstruction of a stepwise morphology and slow grain growth resulting from the abundance of annealing twins in this wire.

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Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan

    Tung-Han Chuang, Hsi-Ching Wang & Chien-Hsun Chuang

  2. Wire Technology Co., LTD, Taichung, 432, Taiwan

    Jun-Der Lee & Hsing-Hua Tsai

Authors
  1. Tung-Han Chuang
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  2. Hsi-Ching Wang
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  3. Chien-Hsun Chuang
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  4. Jun-Der Lee
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  5. Hsing-Hua Tsai
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Correspondence to Tung-Han Chuang.

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Chuang, TH., Wang, HC., Chuang, CH. et al. Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires. J. Electron. Mater. 42, 545–551 (2013). https://doi.org/10.1007/s11664-012-2381-2

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  • DOI: https://doi.org/10.1007/s11664-012-2381-2

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