This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85°C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
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G.T. Galyon, IEEE Trans. Packag. Manuf. 28, 94 (2005).
M. Dittes, P. Oberndorff, and L. Petit, Proceedings of Electronic Components and Technology Conference (New Orleans, LA, 2003), p. 822.
R. Schetty, IEEE International Conference on the Business of Electronic Product Reliability and Liability (2004).
M. Dittes, P. Oberndorff, P. Crema, and V. Schroeder, Proceedings of Electronic Packaging Technology Conference (Singapore, 2003), p. 183.
J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, K.N. Hooghan, P. Suratkar, and P. Ruengsinsub, IEEE Trans. Packag. Manuf. 28, 36 (2005).
P. Snugovsky, Z. Bagheri, M. Romansky, SMTA Conference (2008)
D. Hillman, IPC/SMTA Cleaning & Conformal Coating Conference (2010).
T. Tsukui, 2nd International Symposium on Whisker Growth (2008).
A. Baated, K.S. Kim, K. Suganuma, S. Huang, B. Jurcik, S. Nozawa, and M. Ueshima, J. Mater. Sci. 21, 1066 (2010).
K. Sweatman, J. Masuda, T. Nozu, M. Koshi, and T. Nishimura, Proceedings of IPC Printed Circuits Expo, APEX Conference (Los Vegas, 2009).
O. Kurtz, J. Barthelmes, and K. Martin, Proceedings of the SMTA International Conference (2008).
J. Arnold, G. Caswell, C. Hillman, and S. Binfield, WWW.dfrsolutions.com/…/HowDfRCanHelpYouControlIonicContami.White. Paper How DfR Can Help You Control Ionic Contamination.
M. Ueshima, 3rd International Symposium on Tin Whiskers (2009).
P. Oberndorff, M. Dittes, P. Crema, P. Su, and E. Yu, IEEE Trans. Electron. Packag. Manuf. 29, 4 (2006).
M. Huehne, 4th International Symposium on Tin Whiskers (2010).
A. Baated, K. S. Kim, K. Suganuma. S. Huang. B. Jurcik, S. Nozawa, B. Stone, and M. Ueshima, Proceedings of SMTA International Conference (2009).
H. Sosiati, S. Hata, N. Kuwano, Y. Iwane, Y. Morizono, and Y. Ohno, Microstructural Characterization of Whiskers and Oxidized Surfaceon Sn/FeNi42 and Pb-free Alloys, Proceedings CARTS Europe 2006 (Bad Homburg, Germany, 2006), pp. 263–269.
F. Song and S.W. Ricky Lee, IEEE, Electronic Components and Technology Conference (2006).
F. Rosalbino, E. Angelini, G. Zanicchi, R. Carlini, and R. Marazza, Electrochim. Acta 54, 7231 (2009).
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Open Access This is an open access article distributed under the terms of the Creative Commons Attribution Noncommercial License (https://creativecommons.org/licenses/by-nc/2.0), which permits any noncommercial use, distribution, and reproduction in any medium, provided the original author(s) and source are credited.
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Snugovsky, P., Meschter, S., Bagheri, Z. et al. Whisker Formation Induced by Component and Assembly Ionic Contamination. J. Electron. Mater. 41, 204–223 (2012). https://doi.org/10.1007/s11664-011-1808-5
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DOI: https://doi.org/10.1007/s11664-011-1808-5