Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements

Abstract

Two samples of Sn-0.5Cu solder alloys, stored at −18°C for 7 years, were chemically analyzed by an inductively coupled plasma-optical emission spectroscopy method. One of the samples was unaffected by this exposure; the other one had completely transformed into brittle α-Sn. Ten elements were found to exhibit statistically significant differences in their concentrations between the two samples, with the higher always associated with the untransformed sample. The highest concentrations were found for elements with an appreciable solubility in Sn, i.e., Bi, In, Pb, and Sb.

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References

  1. 1.

    Official Journal of the European Union (L37) (2003), 19; 24. (http://europa.eu.int/eur-lex/lex/JOHtml.do?uri=OJ:L:2003:037:SOM:EN:HTML)

  2. 2.

    See any text book on Inorganic Chemistry, e.g., N. Wiberg, Hollemann-Wiberg: Lehrbuch der Anorganischen Chemie, 102nd ed. (Berlin - New York: de Gruyter, 2007).

  3. 3.

    P. Villard and L.D. Calvert, Pearson’s Handbook of Crystallographic Data for Intermetallic Phases, 2nd ed., Vol. 4 (Materials Park, OH: ASM International, 1991), p. 5285.

    Google Scholar 

  4. 4.

    W.J. Plumbridge, J. Mater. Sci. Mater. Electron. 18, 307 (2007).

    Article  CAS  Google Scholar 

  5. 5.

    G. Tamman and K.L. Dreyer, Z. Anorg. Chem. 199, 97 (1931).

    Article  Google Scholar 

  6. 6.

    E. Cohen and A.K.W.A. van Lieshout, Proc. K. Akad. Wet., Amsterdam 39, 1174 (1936).

    CAS  Google Scholar 

  7. 7.

    E. Cohen, W.A.T. Cohen de Meester, and J. Landsman, Proc. K. Akad. Wet., Amsterdam 40, 746 (1937).

    CAS  Google Scholar 

  8. 8.

    W.J. Plumbridge, J. Electron. Mater. 37, 218 (2008).

    Article  CAS  ADS  Google Scholar 

  9. 9.

    Y. Kariya, N. Williams, C.R. Gagg, and W.J. Plumbridge, J. Met. 53(6), 39 (2001).

    CAS  Google Scholar 

  10. 10.

    G.V. Raynor and R.W. Smith, Proc. R. Soc. 244A, 101 (1958).

    ADS  Google Scholar 

  11. 11.

    E. Cohen and A.K.W.A. van Lieshout, Proc. K. Akad. Wet., Amsterdam 39, 352 (1936).

    CAS  Google Scholar 

  12. 12.

    E. Cohen, A.K.W.A. van Lieshout, and W.A.T. Cohen de Meester, Z. Phys. Chem. 178, 221 (1937).

    Google Scholar 

  13. 13.

    R.R. Rogers and J.F. Fydell, J. Electrochem. Soc. 100, 383 (1953).

    Article  CAS  Google Scholar 

  14. 14.

    C.W. Mason and W.D. Forgeng, Met. Alloy 6, 87 (1935).

    CAS  Google Scholar 

  15. 15.

    T.B. Massalski, H. Okamoto, P.R. Subramanian, and L. Kacprzak, eds., Binary Alloy Phase Diagrams, 2nd ed. (Materials Park, OH: ASM International, 1990), p. 796, 2296, 3016, 3306.

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Acknowledgement

This research is a contribution to the European COST Action MP 0602. Financial support of the Austrian Science Foundation (FWF) under Project No. P 17346 is gratefully acknowledged.

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Correspondence to Herbert Ipser.

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Leodolter-Dworak, M., Steffan, I., Plumbridge, W.J. et al. Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements. Journal of Elec Materi 39, 105–108 (2010). https://doi.org/10.1007/s11664-009-0958-1

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Keywords

  • Metal and alloys
  • lead-free solders
  • aging
  • phase transformations
  • tin pest
  • chemical analysis