Abstract
The purpose of this study is to develop a methodology to predict the low-cycle (large strain—from 0.1 to 0.35 strain) fatigue life of solders subject to thermal cycling. Solders are commonly used in electronic assemblies. Using thermal fatigue data measured for 80In15Pb5Ag, a low-cycle fatigue curve for 80In15Pb5Ag solder subject to thermal cycling was developed. Specifically a Coffin-Manson relationship was derived for the solder, with a high degree of correlation (see Table I), for four different failure criteria, defined in the body of the paper. This relationship, together with calculated strains in the solder joint, allows the low-cycle fatigue life of the solder joint to be predicted.
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L.K. Edwards, R.S. Lakes, and W.A. Nixon, J. Appl. Phys. 87, 1135 (2000).
J.E. Shigley, Mechanical Engineering Design, 4th ed. (New York: McGraw Hill, 1983).
D.R. Frear, N.R. Sorenson, and J.S. Martens, Fatigue of Electronic Materials, ASTM STP 1153, ed. S.A. Schroeder and M.R. Mitchell (Philadelphia, PA: American Society for Testing and Materials, 1994), p. 95.
W. Engelmaier, Solder Joint Reliability Theory and Applications, ed. J.H. Lau (New York: Van Nostrand, 1991), p. 545.
J.K. Tien, B.C. Hendrix, and A.I. Attarwala, Solder Joint Reliability Theory and Applications, ed. J.H. Lau (New York: Van Nostrand, 1991), p. 279.
C.G. Schmidt, J.W. Simons, and C.H. Kanazawa, Solder Joint Integrity Multiclient Program, Final Report (Menlo Park, CA: SRI International, September 1992).
Specialty Solders and Alloys (Utica, NY: Indium Corporation of America, 1988).
Reflow Profile, RMA -F/-M Flux/Vehicles, Indalloy #2 (80In15Pb5Ag) (Utica, NY: Indium Corporation of America, 1988).
L.K. Edwards, Development of a Viscoelastic Model and Thermal Fatigue Model for the Indium Alloy 80In15Pb5Ag (Ann Arbor, MI: IMU Dissertation Services, 1997).
J.L. Marshall, Solder Joint Reliability, Theory and Applications, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1991), p. 173.
J.S. Hwang and H.J. Koenigsmann, Surface Mount Tech. Mag., 11, 50 (1997).
J.W. Morris, Jr., D. Tribula, T.S.E. Summers, and D. Grivas, Solder Joint Reliability, Theory and Applications, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1991), p, 225.
R.N. Wild, Some Fatigue Properties of Solders and Solder Joints, IBM No.: 732Z000421 (January 1973).
M. Witt, Surface Mount Tech. Mag., 10, 70 (1996).
J.K. Hagge (Paper presented at the Second Annual Int. Electron. Pkg. Soc. Meeting, San Diego, CA, 14–17 November 1982).
R.N. Wild (Paper presented at INTERNEPCON, Brighton, England, October 1975).
J.K. Hagge, (Paper presented at the Second Annual Int. Electron. Pkg. Soc. Meeting, San Diego, CA, 17 November 1982).
L.K. Edwards, W.A. Nixon, and R.S. Lakes, accepted for publication J. Electron Mater. 28, 1084 (1999).
W. Engelmaier, IEEE Trans. on Components, Hybrids, and Manufacturing Tech., CHMT-6, 234 (1983).
R.S. Figliola and D.E. Beasley, Theory and Design for Mechanical Measurements, 2nd ed. (New York: John Wiley & Sons, Inc., 1995).
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Edwards, L.K., Nixon, W.A. & Lakes, R.S. Development of a low-cycle fatigue life curve for 80In15Pb5Ag. J. Electron. Mater. 29, 1084–1089 (2000). https://doi.org/10.1007/s11664-004-0269-5
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DOI: https://doi.org/10.1007/s11664-004-0269-5