Abstract
The microstructures of Cu films deposited by the self-ion assisted, partially ionized beam (PIB) deposition technique under two different accelerating potentials, 0 KeV and 6 KeV, are compared. The 6 KeV film shows a bimodal (111) fiber and (100) fiber texture with an abundance of twin boundaries and a relatively large average grain size with a typical lognormal distribution. The 0 KeV film consists of small, mostly (111) oriented grains with islands of abnormally large (100) grains. The controlling factors for the abnormal growth of the (100) grains are discussed in relation to the observed microstructures, showing that all factors necessary for abnormal (100) growth are present in the films.
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O.V. Kononenko, V.N. Matveev, A.Y. Kasumov, N.A. Kislov, and I.I. Khodos, Vacuum 46, 684 (1995).
O.V. Kononenko, E.D. Ivanov, V.N. Matveev, and I.I. Khodos, Scripta Metall. Mater 33, 1981 (1995).
D.P. Field, O.V. Kononenko, and V.N. Matveev, Mater. Res. Soc. Symp. Proc. 473, 369 (1997).
S. Vaidya and A.K. Sinha, Thin Solid Films 75, 253 (1983).
S.-K. Koh, W.-K. Choi, K.-H. Kim, and H.-J. Jung, Thin Solid Films 287, 266 (1996).
B.L. Adams, S.I. Wright, and K. Kunze, Metall. Trans. A 24A, 819 (1993).
N.C. Krieger-Lassen, K. Conradsen, and D. Juul-Jensen, Scanning Microsc. 6, 115 (1992).
D.G. Brandon, Acta Metall. 14, 1479 (1966).
G.P. Beyer, P. Kitabijan, S.H. Brongersma, H. Bender, E. Richard, I. Vervoort, P. Hey, P. Zhang, and K. Maex, Proc. of the Advanced Metallization Conference in 1999, ed. M.E. Gross, T. Gessne, N. Kobayashi, and Y. Yasuda, (Warrendale, PA: MRS, 2000).
E.M. Zielinski, R.P. Vinci, and J.C. Bravman, J. Appl. Phys. 76, 4516 (1994).
J.M.E. Harper, J. Gupta, D.A. Smith, J.W. Chang, K.L. Holloway, C. Cabral, Jr., D.P. Tracy, and D.B. Knorr, Appl. Phys. Lett. 65, 177 (1994).
J. Greiser, P. Müllner, and E. Arzt, Acta Mater. 49, 1041 (2001).
A. Sekiguchi, J. Koike, S. Kamiya, M. Saka, and K. Maruyama, Appl. Phys. Lett. 79, 1264 (2001).
J.E. Sanchez, Jr. and E. Arzt, Scripta Metall. 27, 285 (1992).
C.V. Thompson, Scripta Metall. 28, 167 (1993).
S. Mader, R. Feder, and P. Chaudhari, Thin Solid Films 14, 63 (1972).
O.V. Kononenko, V.N. Matveev, Y.I. Koval, S.V. Dubonos, and V.T. Volkov, Materials Reliability in Microelectronics, vol. 428 ed. W.F. Filter, J.J. Clement, A.S. Oates, R. Rosenberg, and P.M. Lenahan (Pittsburgh, PA: Materials Research Society, 1996), pp. 61–66.
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Field, D.P., Kononenko, O.V. & Matveev, V.N. The microstructure of Cu films deposited by the self-ion assisted technique. J. Electron. Mater. 31, 40–44 (2002). https://doi.org/10.1007/s11664-002-0170-z
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DOI: https://doi.org/10.1007/s11664-002-0170-z