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Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

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Abstract

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu6Sn5 particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu6Sn5 precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.

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Authors and Affiliations

  1. Division of Materials Science and Engineering, Korea University, 136-701, Seoul, Korea

    C. K. Shin & J. Y. Huh

  2. Thin Film Research Center, Korea Institute of Science and Technology, 130-650, Seoul, Korea

    Y. J. Baik

Authors
  1. C. K. Shin
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  2. Y. J. Baik
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  3. J. Y. Huh
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Shin, C.K., Baik, Y.J. & Huh, J.Y. Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints. J. Electron. Mater. 30, 1323–1331 (2001). https://doi.org/10.1007/s11664-001-0119-7

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  • DOI: https://doi.org/10.1007/s11664-001-0119-7

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