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Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

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Abstract

The dissolution of Cu into molten Sn-3.8at.%Ag (Sn-3.5wt.%Ag) solder and its effect on microstructure were studied by light microscopy, scanning microscopy, and x-ray microanalysis. X-ray microanalysis of the average Cu content of samples soldered under various conditions showed that the amount of Cu dissolved during soldering increased with increasing soldering temperature and time and that the rate of dissolution could be described by a Nernst-Brunner equation. Microstructurally it was found that the volume fractions of primary β(Sn) dendrites and η-phase dendrites increase with increasing soldering temperature and time. The microstructural changes can be explained using Sn-Ag-Cu phase equilibrium data. A numerical method was developed for calculating the amount of Cu dissolved under non-isothermal conditions, which describes dissolution reasonably well.

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Author notes

  1. S. Chada

    Present address: Motorola, 8000 West Sunrise Blvd., 33322, Fort Lauderdale, FL

  2. W. Laub

    Present address: Solectron GmbH, Solectronstr. 2, 71083, Herrenberg, Germany

Authors and Affiliations

  1. Materials Science and Engineering Program, Marquette University, 53201, Milwaukee, WI

    S. Chada, R. A. Fournelle & W. Laub

  2. Visteon Automotive Systems, Ford Motor Company, 17000 Rotunda Drive, 48121, Dearborn, MI

    D. Shangguan

Authors
  1. S. Chada
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  2. R. A. Fournelle
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  3. W. Laub
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  4. D. Shangguan
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Chada, S., Fournelle, R.A., Laub, W. et al. Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure. J. Electron. Mater. 29, 1214–1221 (2000). https://doi.org/10.1007/s11664-000-0015-6

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  • DOI: https://doi.org/10.1007/s11664-000-0015-6

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