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Quantifying the Crack-Tip Residual Stress of Nickel-Based Single-Crystal Alloys at the Micron Scale by Focused Ion Beam and Digital Image Correlation

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Abstract

The cracking of nickel-based single-crystal alloys is associated with the residual stress. In this paper, we employed focused ion beam and digital image correlation (FIB-DIC) technology to characterize the crack-tip residual stress at ultrahigh spatial resolution. The repeatability and accuracy of FIB-DIC were validated by experiments and simulations. A direct correlation between residual stress and hardness was established, which provides a new way to prevent cracking through the visualization and control of residual stress.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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  • 09 September 2023

    The corresponding authors’ contact emails have been added.

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Acknowledgments

This work was financially supported by the National Key Research & Development Plan (Grant No. 2020YFA0405900), the National Natural Science Foundation of China (Grant Nos. 52171117, 92263201, 51927801), and State Key Lab of Advanced Metals and Materials (Grant No. 2022-Z19).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, P.R. China

    Haoyi Niu & Qing Liu

  2. School of Advanced Technology, Xi’an Jiaotong-Liverpool University, Suzhou, 215123, P.R. China

    Wei Sun

  3. Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, P.R. China

    Rengeng Li, Kesong Miao, Yiping Xia, Chenglu Liu, Xuewen Li, Hao Wu, Qing Liu & Guohua Fan

  4. Advanced Materials Research Institute, Yangtze Delta, Suzhou, 215100, P.R. China

    Guohua Fan

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  1. Haoyi Niu
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  2. Wei Sun
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Correspondence to Yiping Xia or Hao Wu.

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Niu, H., Sun, W., Li, R. et al. Quantifying the Crack-Tip Residual Stress of Nickel-Based Single-Crystal Alloys at the Micron Scale by Focused Ion Beam and Digital Image Correlation. Metall Mater Trans A 54, 4215–4221 (2023). https://doi.org/10.1007/s11661-023-07184-9

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