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Ultrafine-Grained Microstructure Development in Cu/Fe Multilayered Sheet During Cooling

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Abstract

Characteristic ultrafine-grained (UFGed) microstructure was developed in the Cu/Fe multilayered sheet annealed at 1123 K and then air-cooled, whereas no UFGed microstructure was observed in the one furnace-cooled. Therefore, the UFGed microstructure is developed during cooling and cooling rate plays an essential role for UFGed microstructure formation in Cu/Fe multilayered sheet. Thermal stress derived from the difference in the thermal expansion coefficients of the layers must be the factor for UFGed microstructure formation during cooling.

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Acknowledgments

The authors are grateful to the TOKUSHU KINZOKU EXCEL Co., Ltd. for providing the Cu-Fe laminated sheets used in this study. This work was supported by the Japan Copper and Brass Association, The Japan Institute of Metals and Materials, JKA and its promotion funds from KEIRIN RACE, and the Grant-in-Aid for Scientific Research (KAKENHI) Grant No. 20K14605.

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Authors and Affiliations

  1. Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University, Kakuma-machi, Kanazawa, Ishikawa, 920-1192, Japan

    Ryusei Kato

  2. Faculty of Mechanical Engineering, Institute of Science and Engineering, Kanazawa University, Kakuma-machi, Kanazawa, Ishikawa, 920-1192, Japan

    Norimitsu Koga & Chihiro Watanabe

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  1. Ryusei Kato
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  2. Norimitsu Koga
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Correspondence to Norimitsu Koga.

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Kato, R., Koga, N. & Watanabe, C. Ultrafine-Grained Microstructure Development in Cu/Fe Multilayered Sheet During Cooling. Metall Mater Trans A 54, 4203–4207 (2023). https://doi.org/10.1007/s11661-023-07168-9

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