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Molecular Dynamics Simulation and Experimental Verification of Microstructure Evolution of Dual-Phase Ti Alloy During Electroshocking Treatment

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Abstract

The effects of electroshocking treatment (EST) on microstructure evolution of dual-phase Ti were investigated by Molecular Dynamics (MD) simulation. From MD results, EST induced the sliding and rotating motion of atoms at grain boundaries, and promoted the interface shift and microregion phase transition. The thermal and athermal effects of EST were distinguished as well. The MD result of microregion phase transition was verified via in situ TEM experiment. All results revealed the effect mechanism of EST.

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Data Availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Acknowledgments

This work was financial supported by National Key R&D Program of China (No. 2020YFA0714900), National Natural Science Foundation of China (Grant No. 51975441, No. 52271135), Major Research Plan of the National Natural Science Foundation of China (Grant No. 92266102), Natural Science Foundation of Hubei Province (Grant No. 2022CFB492), Knowledge Innovation Program of Wuhan -Basic Research (No. 2022010801010174), “Chu Tian Scholar” project of Hubei Province (CTXZ2017-05), Overseas Expertise Introduction Project for Discipline Innovation (B17034) and Innovative Research Team Development Program of Ministry of Education of China (IRT_17R83).

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Contributions

LX, YY, CL, and YY: Investigation, Data curation, Methodology, Writing—original draft, Writing—review & editing. FY, DQ and YS: Writing—review & editing. LW and L-CZ: Writing—review & editing. LH: Conceptualization, Project administration, Supervision, Writing—review & editing.

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Correspondence to Lechun Xie or Lin Hua.

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Xie, L., Yao, Y., Liu, C. et al. Molecular Dynamics Simulation and Experimental Verification of Microstructure Evolution of Dual-Phase Ti Alloy During Electroshocking Treatment. Metall Mater Trans A 54, 2982–2988 (2023). https://doi.org/10.1007/s11661-023-07094-w

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