Abstract
A sequential coupled thermo-mechanical model was developed for laser-based direct energy deposition of single- IN718 and multi-material IN718-Ti6Al4V systems to monitor the thermal stability, solidification characteristics and origin of the residual stresses in each successively deposited layer in real-time. A qualitative agreement was observed between the model and experimental measurements of temperature field and residual stress in the ten layered build system. The substitution of the IN718 substrate with Ti6Al4V alloy caused remarkable temperature rise (~ 220 K) in the preliminary deposited layers due to the high thermal energy accumulation in Ti6Al4V, leading to relatively low solidification velocity (2.02 mm/s) and large melt pool (0.95 mm). The heat sink effect of the substrate was effective up to the deposition of five-layers. The calculated solidification parameters, i.e., temperature gradient, G and solidification velocity, R suggested a columnar structured interface for both systems in the solidification map. The primary arm dendritic spacing (PDAS) ranging from 8.9 to 21.7 μm increased to 10.8 to 24.6 μm on changing the substrate from IN718 (10IN/IN) to Ti6Al4V (10IN/Ti). The overall tensile residual stress reduced from 655 MPa in the 10IN/IN to 621 MPa in the 10IN/Ti due to the lowered thermal gradient. However, an interesting reversal of maximum tensile residual stress, σ11 location from the top (tenth layer) to the first layer occurred on changing the substrate from IN718 to Ti6Al4V due to the substantial difference in the coefficient of thermal expansion (ΔCTE ~ 4.3 × 10–6 K−1) at the interface.
Similar content being viewed by others
References
L.Y. Zhou, J. Fu, and Y. He: Adv. Funct. Mater., 2020, vol. 30, pp. 1–38.
A. Le Duigou, M. Castro, R. Bevan, and N. Martin: Mater. Des., 2016, vol. 96, pp. 106–14.
Y.W.D. Tay, M.Y. Li, and M.J. Tan: J. Mater. Process. Technol., 2019, vol. 271, pp. 261–70.
A. Bandyopadhyay and B. Heer: Mater. Sci. Eng. R, 2018, vol. 129, pp. 1–6.
E. Mirkoohi, J.R. Dobbs, and S.Y. Liang: Int. J. Adv. Manuf. Technol., 2020, vol. 106, pp. 4105–21.
E. Mirkoohi, D.E. Sievers, H. Garmestani, and S.Y. Liang: CIRP J. Manuf. Sci. Technol., 2020, vol. 28, pp. 52–67.
E. Mirkoohi, J.R. Dobbs, and S.Y. Liang: J. Manuf. Process., 2020, vol. 58, pp. 41–54.
Z.C. Fang, Z.L. Wu, C.G. Huang, and C.W. Wu: Opt. Laser Technol., 2020, vol. 129, p. 106283.
Q. Wu, T. Mukherjee, C. Liu, J. Lu, and T. DebRoy: Addit. Manuf., 2019, vol. 29, p. 100808.
A.M. Kamara, W. Wang, S. Marimuthu, and L. Li: Proc. Inst. Mech. Eng. Part B, 2011, vol. 225, pp. 87–99.
Q. Jia and D. Gu: J. Alloys Compd., 2014, vol. 585, pp. 713–21.
S.Y. Gaol, Y.Z. Zhang, L.K. Shi, and B.L. Du: 2007, pp. 171–80.
S. Maietta, A. Gloria, G. Improta, M. Richetta, R. De Santis, and M. Martorelli: J. Healthc. Eng., 2019, https://doi.org/10.1155/2019/3212594.
C. Qiu, N.J.E. Adkins, and M.M. Attallah: Mater. Sci. Eng. A, 2013, vol. 578, pp. 230–39.
L.Y. Chen, J.C. Huang, C.H. Lin, C.T. Pan, S.Y. Chen, T.L. Yang, D.Y. Lin, H.K. Lin, and J.S.C. Jang: Mater. Sci. Eng. A, 2017, vol. 682, pp. 389–95.
P. Kyvelou, H. Slack, D. Daskalaki Mountanou, M.A. Wadee, T. Ben Britton, C. Buchanan, and L. Gardner: Mater. Des., 2020, vol. 192, p. 108675.
V. Laghi, L. Tonelli, M. Palermo, M. Bruggi, R. Sola, L. Ceschini, and T. Trombetti: Addit. Manuf., 2021, vol. 42, p. 101999.
M. Ghaffari, A. Vahedi Nemani, M. Rafieazad, and A. Nasiri: Jom, 2019, vol. 71, pp. 4215–24.
X. Wang, X. Gong, and K. Chou: Proc. Inst. Mech. Eng. Part B, 2017, vol. 231, pp. 1890–1903.
G.P. Dinda, A.K. Dasgupta, and J. Mazumder: Mater. Sci. Eng. A, 2009, vol. 509, pp. 98–104.
N.A. Kistler, A.R. Nassar, E.W. Reutzel, D.J. Corbin, and A.M. Beese: J. Laser Appl., 2017, vol. 29, p. 022005.
J.S.K.E.W.R. Cory, D. Jamieson, Marissa C. Brennan, Todd J. Spurgeon, Stephen W. Brown: J. Laser Appl. https://doi.org/10.2351/7.0000534.
M. Bambach, I. Sizova, F. Kies, and C. Haase: Addit. Manuf., 2021, vol. 47, p. 102269.
Z. Liu, B. He, T. Lyu, and Y. Zou: Jom, 2021, vol. 73, pp. 1804–08.
Y. Lu, S. Wu, Y. Gan, T. Huang, C. Yang, L. Junjie, and J. Lin: Opt. Laser Technol., 2015, vol. 75, pp. 197–206.
P. Rangaswamy, M.L. Griffith, M.B. Prime, T.M. Holden, R.B. Rogge, J.M. Edwards, and R.J. Sebring: Mater. Sci. Eng. A, 2005, vol. 399, pp. 72–83.
L. Wang, S.D. Felicelli, and P. Pratt: Mater. Sci. Eng. A, 2008, vol. 496, pp. 234–41.
R.J. Moat, A.J. Pinkerton, L. Li, P.J. Withers, and M. Preuss: Mater. Sci. Eng. A, 2011, vol. 528, pp. 2288–98.
N. Nadammal, S. Cabeza, T. Mishurova, T. Thiede, A. Kromm, C. Seyfert, L. Farahbod, C. Haberland, J.A. Schneider, P.D. Portella, and G. Bruno: Mater. Des., 2017, vol. 134, pp. 139–50.
J. Hönnige, C.E. Seow, S. Ganguly, X. Xu, S. Cabeza, H. Coules, and S. Williams: Mater. Sci. Eng. A, 2020, https://doi.org/10.1016/j.msea.2020.140368.
K. Kempen, L. Thijs, B. Vrancken, S. Buls, J. Van Humbeeck, and J.P. Kruth: 24th Int. SFF Symp. - An Addit. Manuf. Conf. SFF 2013, 2013, pp. 131–39.
P.J. Withers and H.K.D.H. Bhadeshia: Mater. Sci. Technol., 2001, vol. 17, pp. 355–65.
A.H. Nickel, D.M. Barnett, and F.B. Prinz: Mater. Sci. Eng. A, 2001, vol. 317, pp. 59–64.
E.R. Denlinger, J.C. Heigel, P. Michaleris, and T.A. Palmer: J. Mater. Process. Technol., 2015, vol. 215, pp. 123–31.
B.A. Szost, S. Terzi, F. Martina, D. Boisselier, A. Prytuliak, T. Pirling, M. Hofmann, and D.J. Jarvis: Mater. Des., 2016, vol. 89, pp. 559–67.
C. Li, Z.Y. Liu, X.Y. Fang, and Y.B. Guo: Procedia CIRP, 2018, vol. 71, pp. 348–53.
A.S. Wu, D.W. Brown, M. Kumar, G.F. Gallegos, and W.E. King: Metall. Mater. Trans. A, 2014, vol. 45A, pp. 6260–70.
M.F. Zaeh and G. Branner: Prod. Eng., 2010, vol. 4, pp. 35–45.
J.P. Kruth, J. Deckers, E. Yasa, and R. Wauthlé: Proc. Inst. Mech. Eng. Part B, 2012, vol. 226, pp. 980–91.
T. Mukherjee, W. Zhang, and T. DebRoy: Comput. Mater. Sci., 2017, vol. 126, pp. 360–72.
M. McMillan, M. Leary, and M. Brandt: Mater. Des., 2017, vol. 132, pp. 226–43.
J. Wang, Y. Wang, and J. Shi: Int. J. Precis. Eng. Manuf., 2021, vol. 8, pp. 1181–96.
C. Carmignani, R. Mares, and G. Toselli: Comput. Methods Appl. Mech. Eng., 1999, vol. 179, pp. 197–214.
N. Keller and V. Ploshikhin: 25th Annu. Int. Solid Free. Fabr. Symp. � An Addit. Manuf. Conf. SFF 2014, 2014, pp. 1229–37.
P. Mercelis and J.P. Kruth: Rapid Prototyp. J., 2006, vol. 12, pp. 254–65.
T. Simson, A. Emmel, A. Dwars, and J. Böhm: Addit. Manuf., 2017, vol. 17, pp. 183–89.
K. Shah, I.U. Haq, S.A. Shah, F.U. Khan, M.T. Khan, and S. Khan: Sci. World J., 2014, https://doi.org/10.1155/2014/841549.
F. Lia, J. Park, J. Tressler, and R. Martukanitz: Addit. Manuf., 2017, vol. 18, pp. 31–39.
B. Kumar and S. Bag: Opt. Lasers Eng., 2019, vol. 122, pp. 209–24.
B. Taljat, B. Radhakrishnan, and T. Zacharia: Mater. Sci. Eng. A, 1998, vol. 246, pp. 45–54.
A.S. Agazhanov, D.A. Samoshkin, and Y.M. Kozlovskii: J. Phys. Conf. Ser., 2019, https://doi.org/10.1088/1742-6596/1382/1/012175.
B. Kumar, S. Bag, S. Mahadevan, C.P. Paul, C.R. Das, and K.S. Bindra: CIRP J. Manuf. Sci. Technol., 2021, vol. 33, pp. 158–75.
J.S. Lee, J.H. Gu, H.M. Jung, E.H. Kim, Y.G. Jung, and J.H. Lee: Mater. Today Proc., 2014, vol. 1, pp. 3–10.
M. Gäumann, C. Bezençon, P. Canalis, and W. Kurz: Acta Mater., 2001, vol. 49, pp. 1051–62.
Y. Lee, M. Nordin, S.S. Babu, and D.F. Farson: Metall. Mater. Trans. B, 2014, vol. 45B, pp. 1520–29.
S. Bontha, N.W. Klingbeil, P.A. Kobryn, and H.L. Fraser: Mater. Sci. Eng. A, 2009, vol. 513–514, pp. 311–18.
W. Kurz and D.J. Fisher: Acta Metall., 1981, vol. 29, pp. 11–20.
R. Trivedi: J. Cryst. Growth, 1980, vol. 49, pp. 219–32.
W. Wang, P.D. Lee, and M. McLean: Acta Mater., 2003, vol. 51, pp. 2971–87.
K. Yuan, W. Guo, P. Li, Y. Zhang, X. Li, and X. Lin: Mech. Mater., 2019, vol. 135, pp. 13–25.
G. Chen, C. Ren, X. Qin, and J. Li: Mater. Des., 2015, vol. 83, pp. 598–610.
T. Singh and V.K. Gupta: Mech. Adv. Mater. Struct., 2014, vol. 21, pp. 384–92.
X. Song, S. Feih, W. Zhai, C.N. Sun, F. Li, R. Maiti, J. Wei, Y. Yang, V. Oancea, L. Romano Brandt, and A.M. Korsunsky: Mater. Des., 2020, vol. 193, p. 108779.
V. Manvatkar, A. De, and T. Debroy: J. Appl. Phys., 2007, https://doi.org/10.1063/1.4896751.
V. Manvatkar, A. De, and T. DebRoy: Mater. Sci. Technol. (United Kingdom), 2015, vol. 31, pp. 924–30.
D. Grange, J.D. Bartout, B. Macquaire, and C. Colin: Materialia, DOI:https://doi.org/10.1016/j.mtla.2020.100686.
H. Qi, J. Mazumder, and H. Ki: J. Appl. Phys., DOI:https://doi.org/10.1063/1.2209807.
X. He and J. Mazumder: J. Appl. Phys., 2007, https://doi.org/10.1063/1.2710780.
C. Guévenoux, S. Hallais, A. Charles, E. Charkaluk, and A. Constantinescu: Opt. Laser Technol., 2020, vol. 128, p. 106218.
G. Langelandsvik, O.M. Akselsen, T. Furu, and H.J. Roven: Materials (Basel), 2021, vol. 14, pp. 1–26.
B. Bellón, A. Boukellal, T. Isensee, O.M. Wellborn, K.P. Trumble, M.J.M. Krane, M.S. Titus, D. Tourret, and J. LLorca: Acta Mater., 2021, https://doi.org/10.1016/j.actamat.2021.116686.
X. Zhang, B. Mao, L. Mushongera, J. Kundin, and Y. Liao: Mater. Des., 2021, vol. 201, p. 109501.
D. Guo, K. Yan, M.D. Callaghan, D. Daisenberger, M. Chatterton, J. Chen, A. Wisbey, and W. Mirihanage: Mater. Des., 2021, vol. 207, p. 109782.
Acknowledgments
The authors gratefully acknowledge the Department of Metallurgical Engineering and Materials Science of Indian Institute of Technology Bombay for providing the computational facility along with licensed ABAQUS® commercial software.
Conflict of interest
On behalf of all authors, the corresponding author states that there are no conflicts of interest.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Kumar, B., Nagamani Jaya, B. Thermal Stability and Residual Stresses in Additively Manufactured Single and Multi-material Systems. Metall Mater Trans A 54, 1808–1824 (2023). https://doi.org/10.1007/s11661-022-06928-3
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11661-022-06928-3