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Design and Achievement of Metallurgical Bonding of Mg/Al Interface Prepared by Liquid–Liquid Compound Casting via a Co-deposited Cu–Ni Alloy Coating

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Abstract

The metallurgical bonding of Mg/Al bimetal by liquid–liquid compound casting was realized via co-deposition Cu–Ni alloy coating. The metallurgical layer of the Mg/Al bimetal consisted of Cu solid solution, Cu2Mg and (Al0.7Cu1.3) Mg, Mg solid solution, Al3Ni2, and Mg2Cu. Vickers hardness of the interface was between 149.9 and 209 HV, which was significantly lower than those of Al–Mg intermetallic compounds. The formation mechanism of the interface was attributed to interdiffusion among AZ91D, A356, and Cu–Ni alloy coating.

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Authors and Affiliations

  1. State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P.R. China

    Guangyu Li, Wenming Jiang, Feng Guan, Junwen Zhu, Yang Yu & Zitian Fan

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  1. Guangyu Li
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  2. Wenming Jiang
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  3. Feng Guan
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  4. Junwen Zhu
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  5. Yang Yu
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  6. Zitian Fan
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Correspondence to Wenming Jiang.

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Manuscript submitted June 6, 2022; accpeted July 31, 2022.

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Li, G., Jiang, W., Guan, F. et al. Design and Achievement of Metallurgical Bonding of Mg/Al Interface Prepared by Liquid–Liquid Compound Casting via a Co-deposited Cu–Ni Alloy Coating. Metall Mater Trans A 53, 3520–3527 (2022). https://doi.org/10.1007/s11661-022-06783-2

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  • DOI: https://doi.org/10.1007/s11661-022-06783-2

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