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Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint

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The microstructure in the bonding interface region of an ultrasonic spot welded Cu/Ni joint was investigated. At the copper side near the bonding interface, all the refined grains with random orientations and high-angle grain boundaries are < 5 nm in size. Nano-sized undulations occur at the Cu/Ni interface. The formation of nano-sized grains and undulation characteristics is ascribed to the dynamic recrystallization as well as shear instability in ultrasonic spot welding.

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This work was funded by the National Natural Science Foundation of China (Grant Nos. 51905171, 51975406) and Henan Province Science and Technology Research and Development Project (Grant No. HNGD2020013).

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Authors and Affiliations

  1. School of Materials Science and Engineering, North China University of Water Resources and Electric Power, Zhengzhou, 450045, P.R. China

    Z. L. Ni, J. J. Yang & L. Huang

  2. School of Mechanical Engineering, North China University of Water Resources and Electric Power, Zhengzhou, 450045, P.R. China

    X. X. Wang

  3. School of Materials Science & Engineering, Tianjin University, Tianjin, 300072, P.R. China

    F. X. Ye

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  1. Z. L. Ni
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  2. J. J. Yang
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  3. X. X. Wang
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  4. L. Huang
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Correspondence to Z. L. Ni or X. X. Wang.

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Manuscript submitted May 2, 2020.

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Ni, Z.L., Yang, J.J., Wang, X.X. et al. Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint. Metall Mater Trans A 51, 5606–5611 (2020). https://doi.org/10.1007/s11661-020-05956-1

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