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Effect of Morphological Change of Ni3Sn4 Intermetallic Compounds on the Growth Kinetics in Electroless Ni-P/Sn-3.5Ag Solder Joint

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Abstract

Recently, the growth kinetics of the intermetallic compound (IMC) Ni3Sn4 related to Ni metallization has been investigated in comparison to Cu6Sn5 growth on Cu metallization. In the literature, Ni3Sn4 growth in liquid Sn was analyzed for IMC morphology, grain coarsening, grain boundary (GB) grooving, and GB diffusion. However, the growth kinetics of Ni3Sn4 on electroless (EL) Ni-P metallization has rarely been investigated. In this study, the morphological change of Ni3Sn4 on EL Ni-P and its effects on growth kinetics were analyzed in detail during a reaction with Sn-3.5Ag at 250 °C for up to 30 minutes and compared with electroplated (EP) Ni. For both cases, the IMC growth kinetics was presumed to be governed by fast GB diffusion accompanied with grain coarsening. The morphology of Ni3Sn4 on EP Ni changed little throughout the reaction. Therefore, a 1/3 power-law could be applicable. However, the aspect ratio (thickness/diameter) of the Ni3Sn4 grains on EL Ni-P decreased with the increasing reaction time, which resulted in a larger time exponent of 4.2. The morphological change from needle to chunk induced a high rate of grain coarsening. Consequently, the IMC growth rate declined according to the reduction of fast diffusion paths (GB area).

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References

  1. S. K. Kang and A. K. Sarkhel: J. Electron. Mater., 1994, vol. 23, pp. 701-07.

    Article  CAS  Google Scholar 

  2. D. Ma, W. D. Wang and S. K. Lahiri: J. Appl. Phys., 2002, vol. 91, pp. 3312-17.

    Article  CAS  Google Scholar 

  3. K. S. Kim, S. H. Huh and K. Suganuma: J. Alloys Compd., 2003, vol. 352, pp. 226-36.

    Article  CAS  Google Scholar 

  4. S. Bader, W. Gust and H. Hieber: Acta mater., 1995, vol. 43, pp. 329-37.

    CAS  Google Scholar 

  5. H. K. Kim and K. N. Tu: Phys. Rev. B, 1996, vol. 53, pp. 16027.

    Article  CAS  Google Scholar 

  6. A. M. Gusak and K. N. Tu: Phys. Rev. B, 2002, vol. 66, pp. 115403.

    Article  Google Scholar 

  7. D. Gur and M. Bamberger: Acta mater., 1998, vol. 46, pp. 4917-23.

    Article  CAS  Google Scholar 

  8. M. Schaefer, R. A. Fournelle and J. Liang: J. Electron. Mater., 1998, vol. 27, pp. 1167-76.

    Article  CAS  Google Scholar 

  9. H. Ji, Y. Qiao and M. Li: Scripta Mater., 2016, vol. 110, pp. 19-23.

    Article  CAS  Google Scholar 

  10. B. Liu, Y. Tian, C. Wang, R. An and Y. Liu: J. Alloys Compd., 2016. vol. 687, pp. 667-73.

    Article  CAS  Google Scholar 

  11. Y. Tian, R. Zhang, C. Hang, L. Niu and C. Wang: Mater. Charact., 2014. vol. 88, pp. 58-68.

    Article  CAS  Google Scholar 

  12. C. Hang, Y. Tian, R. Zhang and D. Yang: J. Mater. Sci.: Mater. Electron., 2013. vol. 24, pp. 3905-13.

    Article  CAS  Google Scholar 

  13. G. Ghosh: Acta mater., 2000, vol. 48, pp. 3719-38.

    Article  CAS  Google Scholar 

  14. G. Ghosh: J. Appl. Phys., 2000, vol. 88, pp. 6887-96.

    Article  CAS  Google Scholar 

  15. R. Labie, W. Ruythooren and J. V. Humbeeck: Intermetallics, 2007, vol.15, pp. 396-403.

    Article  CAS  Google Scholar 

  16. M. O. Alam and Y. C. Chan: J. Appl. Phys., 2005, vol. 98, pp. 123527.

    Article  Google Scholar 

  17. H. S. Kim, H. J. Lee, Y. S. Yu and Y. S. Won: Acta Mater., 2009, vol. 57, pp. 1254-62.

    Article  CAS  Google Scholar 

  18. Y. Wang, J. Huang, Z. Ye, X. Peng, J. Yang, S. Chen and X. Zhao: Metall. Mater. Trans. A, 2019, vol. 50, pp. 3038-43.

    Article  Google Scholar 

  19. A. Lis, C. Kenel and C. Leinenbach: Metall. Mater. Trans. A, 2016, vol. 47, pp. 2596-2608.

    Article  Google Scholar 

  20. J. Shen, Y. C. Chan and S. Y. Liu: Acta Mater., 2009, vol. 57, pp. 5196-06.

    Article  CAS  Google Scholar 

  21. J. Görlich, D. Baither and G. Schmitz: Acta Mater., 2010, vol. 58, pp. 3187-97.

    Article  Google Scholar 

  22. A. Nakane, T. Suzuki, M. Ohm and M. Kajihara: Mater. Trans., 2016, vol. 57, pp. 838-45.

    Article  CAS  Google Scholar 

  23. K. Chen, C. Liu, D. C. Whalley, D. A. Hutt, J. F. Li and S. H. Mannan: Acta Mater., 2008, vol. 56, pp. 5668-76

    Article  CAS  Google Scholar 

  24. H. B. Kang, J. H. Bae, J. W. Yoon, S. B. Jung, J. W. Park and C. W. Yang, Scripta Mater., 2010, vol. 63, pp. 1108-11.

    Article  CAS  Google Scholar 

  25. C. K. Chung, Y. J. Chen, W. M. Chen and C. R. Kao: Acta Mater., 2012, vol. 60, pp. 4586-93.

    Article  CAS  Google Scholar 

  26. J. W. Yoon, J. H. Bang, C. W. Lee and S. B. Jung: J. Alloys Compd., 2015, vol. 627, pp. 276-80.

    Article  CAS  Google Scholar 

  27. W. Z. Hsieh, M. A. Rahman, T. H. Yang, T. T. Kuo and C. E. Ho: Surf. Coat. Tech., 2016, vol. 303, pp. 112-18.

    Article  CAS  Google Scholar 

  28. J. W. Jang, P. G. Kim, K. N. Tu, D. R. Frear and P. Thompson: J. Appl. Phys., 1999, vol. 85, pp. 8456-63.

    Article  CAS  Google Scholar 

  29. S. P. Peng, W. H. Wu, C. E. Ho and Y. M. Huang: J Alloys Compd., 2010, vol. 493, pp. 431-37.

    Article  CAS  Google Scholar 

  30. J. W. Yoon and S. B. Jung: J Alloys Compd., 2004, vol. 376, pp. 105-10.

    Article  CAS  Google Scholar 

  31. J. W. Yoon, C. B. Lee and S. B. Jung: Mater. Trans., 2002, vol. 43, pp. 1821-26.

    Article  Google Scholar 

  32. H. Y. Chen and C. Chen: J. Mater. Res., 2012, vol. 27, pp. 1169-77.

    Article  CAS  Google Scholar 

  33. S. H. Park and D. N. Lee: J. Mater. Sci., 1998, vol. 23, pp. 1643-54.

    Article  Google Scholar 

  34. K. H. Hur, J. H. Jeong and D. N. Lee: J. Mater. Sci., 1990, vol. 25, pp. 2573-84.

    Article  CAS  Google Scholar 

  35. Y. C. Sohn, J. Yu, S. K. Kang, D. Y. Shih and T. Y. Lee: J. Mater. Res., 2004, vol. 19, pp. 2428-36.

    Article  CAS  Google Scholar 

  36. K. C. Hung, Y. C. Chan, C. W. Tang and H. C. Ong: J. Mater. Res., 2000, vol. 15, pp. 2534-39.

    Article  CAS  Google Scholar 

  37. K. C. Hung and Y. C. Chan: J. Mater. Sci. Lett., 2000, vol. 19, pp. 1755-57.

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Department of Welding & Joining Science Engineering, College of Engineering, Chosun University, 309 Pilmun-daero, Dong-gu, Gwangju, 61452, Korea

    Yoonchul Sohn

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  1. Yoonchul Sohn
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Correspondence to Yoonchul Sohn.

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Manuscript submitted November 26, 2019.

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Sohn, Y. Effect of Morphological Change of Ni3Sn4 Intermetallic Compounds on the Growth Kinetics in Electroless Ni-P/Sn-3.5Ag Solder Joint. Metall Mater Trans A 51, 2905–2914 (2020). https://doi.org/10.1007/s11661-020-05739-8

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