Metallurgical and Materials Transactions A

, Volume 47, Issue 8, pp 3785–3789

Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper under Tensile Deformation at Room Temperature


DOI: 10.1007/s11661-016-3573-9

Cite this article as:
Yu, H., Lu, C., Tieu, A.K. et al. Metall and Mat Trans A (2016) 47: 3785. doi:10.1007/s11661-016-3573-9


Grain growth and grain refinement behavior during deformation determine the strength and ductility of ultrafine-grained materials. We used asymmetric cryorolling to fabricate ultrafine-grained copper sheets with an average grain width of 230 nm and having a laminate structure. The sheets show a high-true failure strain of 1.5. Observation of the microstructure at the fracture surface reveals that ultrafine laminate-structured grains were simultaneously transformed into both equiaxed nanograins and coarse grains under tensile deformation at room temperature.

Supplementary material

11661_2016_3573_MOESM1_ESM.jpg (2.1 mb)
Supplementary material 1 (JPEG 2116 kb) Fig. S1 TEM image of grains distribution near fracture surface of Cu sheet fabricated by cryorolling.
11661_2016_3573_MOESM2_ESM.jpg (2.7 mb)
Supplementary material 2 (JPEG 2802 kb) Fig. S2 Detail of grain refinement and grain growth near fracture surface of Cu sheet fabricated by cryorolling.

Copyright information

© The Minerals, Metals & Materials Society and ASM International 2016

Authors and Affiliations

  1. 1.School of Mechanical, Materials & Mechatronics EngineeringUniversity of WollongongWollongongAustralia
  2. 2.Electron Microscope UnitUniversity of New South WalesSydneyAustralia
  3. 3.State Key Laboratory of High Performance Complex ManufacturingCentral South UniversityChangshaChina

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