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Nanoscale Copper and Copper Compounds for Advanced Device Applications

  • Symposium: Micromechanics of Advanced Materials III in Honor of J.C.M. Li
  • Published:
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Abstract

Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

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Acknowledgment

The author acknowledges the support of the Ministry of Science and Technology of Taiwan under Project Numbers MOST 104-2221-E-007-030-MY3 and MOST 102-2633-M-007-002.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan

    Lih-Juann Chen (Professor)

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  1. Lih-Juann Chen
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Correspondence to Lih-Juann Chen.

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Manuscript submitted November 29, 2015.

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Chen, LJ. Nanoscale Copper and Copper Compounds for Advanced Device Applications. Metall Mater Trans A 47, 5845–5851 (2016). https://doi.org/10.1007/s11661-016-3477-8

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