Abstract
Experiments are carried out to measure the volume shrinkage during solid-state reaction in micro-joints for three-dimensional integrated circuit applications. Surface profilometer is employed to measure the volume shrinkage for the reaction between Ni and Sn. The shrinkage is correlated with the microstructural evolution during the reaction. It is found that the volume shrinkage is released through both joint height reduction and void formation. The resulting internal stress and the void formation might post potential reliability issues.
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H. Y. Chuang, T. L. Yang, M. S. Kuo, Y. J. Chen, J. J. Yu, C. C. Li, and C. R. Kao: IEEE Trans. Device Mater. Rel., 2012, vol. 12, no. 2, pp. 233-240.
K. Kulojärvi, V. Vuorinen, and J. Kivilahti: Microelectron. Int., 1998, vol. 15, no. 2, pp. 20-24.
W.M. Chen, T.L. Yang, C.K. Chung, and C.R. Kao: Scripta Mater., 2011, vol. 65, no. 4, pp. 331-334.
H.Y. Chuang, J.J. Yu, M.S. Kuo, H.M. Tong, and C.R. Kao: Scripta Mater., 2012, vol. 66, no. 3-4, pp. 171-174.
C. E. Ho, S. C. Yang, and C. R. Kao: J. Mater. Sci.-Mater. El., 2007, vol. 18, no. 1-3, pp. 155-174.
P. R. Frederikse, R.J. Fields, and A. Feldman: J. Appl. Phys., 1992, vol. 72, no.7, pp. 2879-2882.
W.M. Haynes and D.R. Lide: Handbook of Chemistry and Physics, 92nd ed., CRC Press, New York, NY, 2012.
M. E. Glicksman: Diffusion in Solids: Field Theory, Solid-State Principles and Applications, p. 79, Wiley, New York, NY, 2000.
J. A. van Beek, S. S. Stolk, and F. J. J. van Loo: Z. Metallk., 1982, vol. 73, pp. 439-444.
C. M. Chen, and S. W. Chen: Acta Mater., 2002, vol. 50, pp. 2461-2469.
G. F. V. Voort: ASM Handbook: Volume 9: Metallography And Microstructures, 9th ed., p. 123, ASM International, Materials Park, OH, 1985.
This work is supported by National Science Council of Taiwan through Grant 101-2221-E-002-162-MY3, and by National Taiwan University through Grant 10R80920-04.
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Manuscript submitted September 13, 2012.
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Li, C.C., Chung, C.K., Shih, W.L. et al. Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints. Metall Mater Trans A 45, 2343–2346 (2014). https://doi.org/10.1007/s11661-014-2263-8
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DOI: https://doi.org/10.1007/s11661-014-2263-8