Partial Transient Liquid-Phase Bonding, Part II: A Filtering Routine for Determining All Possible Interlayer Combinations
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Partial transient liquid-phase (PTLP) bonding is currently an esoteric joining process with limited applications. However, it has preferable advantages compared with typical joining techniques and is the best joining technique for certain applications. Specifically, it can bond hard-to-join materials as well as dissimilar material types, and bonding is performed at comparatively low temperatures. Part of the difficulty in applying PTLP bonding is finding suitable interlayer combinations (ICs). A novel interlayer selection procedure has been developed to facilitate the identification of ICs that will create successful PTLP bonds and is explained in a companion article. An integral part of the selection procedure is a filtering routine that identifies all possible ICs for a given application. This routine utilizes a set of customizable parameters that are based on key characteristics of PTLP bonding. These parameters include important design considerations such as bonding temperature, target remelting temperature, bond solid type, and interlayer thicknesses. The output from this routine provides a detailed view of each candidate IC along with a broad view of the entire candidate set, greatly facilitating the selection of ideal ICs. This routine provides a new perspective on the PTLP bonding process. In addition, the use of this routine, by way of the accompanying selection procedure, will expand PTLP bonding as a viable joining process.
The current study was funded by the Office of Naval Research under Grant Number N00014-07-1-0872, thanks to Dr. William Mullins, Program Officer.
- 2.G.O. Cook III and C.D. Sorensen: Metall. Mater. Trans. A, 2013. DOI: 10.1007/s11661-013-1956-8.
- 3.W. Tillmann and E. Lugscheider: Int. J Join. Mat., 1996, vol. 8, pp. 56–61.Google Scholar
- 4.D.R. Askeland and P.P. Phulé: The science and engineering of materials, fifth ed, Thomson, Ontario, 2006.Google Scholar
- 6.S. Russ, C. Woodward, Y.W. Kim, and F. Yolton: Conf. Paper Prepr. AFRL-RX-WP-TP-2009-4154, 2008.Google Scholar
- 8.J.A. Pask and I.A. Aksay: Mat. Sci. Res., 1974, vol. 9, pp. 433–444.Google Scholar
- 9.R.K. Wilcoxon, A.P. Boone, and J.R. Wooldridge: US Patent 7,830,021, 2010.Google Scholar
- 10.T. Gray: The Photographic Periodic Table of the Elements. http://www.periodictable.com/, 2010. Accessed 12 May 2011.
- 11.H. Okamoto: Desk Handbook: Phase Diagrams for Binary Alloys, ASM International, Materials Park, Ohio, 2000.Google Scholar
- 12.A. Schnell, A. Stankowski, and E. deMarcos: Proc. GT2006, ASME Turbo Expo 2006: Power For Land, Sea, Air, Barcelona, 2006.Google Scholar
- 13.W.D. Kay: ASM Handbook: welding, brazing, soldering, vol. 6, ASM International, Metals Park, 1993.Google Scholar
- 17.G.O. Cook III: Ph.D. Dissertation, Brigham Young University, 2011.Google Scholar
- 18.I. Tuah-Poku, M. Dollar, and T.B. Massalski: Metall. Trans. A, 1988, vol. 19A, pp. 675–686.Google Scholar