Metallurgical and Materials Transactions A

, Volume 44, Issue 7, pp 2914–2916 | Cite as

Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond

  • Torleif André Tollefsen
  • Ole Martin Løvvik
  • Knut Aasmundtveit
  • Andreas Larsson
Communication

Abstract

The effect of temperature on the die shear strength of a optimized Au-Sn solid–liquid interdiffusion SLID bond, a reliable high temperature die attach and interconnect technology, was investigated. The shear strength was greatly reduced with temperature from 140 MPa at room temperature to 20 MPa at 573 K (300 °C). This reduction was unexpected since the melting point of a Au-Sn SLID bond is 795 K (522 °C). Fractographic studies revealed a change in fracture mode with increasing temperatures. This work emphasizes the importance of performing bond strength quantification at the intended application temperature.

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Copyright information

© The Minerals, Metals & Materials Society and ASM International 2013

Authors and Affiliations

  • Torleif André Tollefsen
    • 1
    • 2
  • Ole Martin Løvvik
    • 3
    • 4
  • Knut Aasmundtveit
    • 2
  • Andreas Larsson
    • 1
  1. 1.SINTEF ICT InstrumentationOsloNorway
  2. 2.Institute for Micro and Nanosystems TechnologyVestfold University CollegeBorreNorway
  3. 3.SINTEF Materials and ChemistryOsloNorway
  4. 4.Department of PhysicsUniversity of OsloOsloNorway

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