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Effects of Pulse Current on Transient Liquid Phase (TLP) Diffusion Bonding of SiCp/2024Al Composites Sheet Using Mixed Al, Cu, and Ti Powder Interlayer

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Abstract

The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 °C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 × 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 × 10−3 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.

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This work is supported by the Fundamental Research Funds for the Central Universities (Grant HIT.KLOF.2010039) and National Natural Science Foundation of China (Grant.51175112).

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Authors and Affiliations

  1. National Key Laboratory of Science and Technology on Precision Heat Processing of Metal, Harbin Institute of Technology, Harbin, 150001, P.R. China

    Bo Wang (Ph.D. Student), Shaosong Jiang (Instructor) & Kaifeng Zhang (Processor)

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  1. Bo Wang
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  2. Shaosong Jiang
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  3. Kaifeng Zhang
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Correspondence to Bo Wang.

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Manuscript submitted April 3, 2012.

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Wang, B., Jiang, S. & Zhang, K. Effects of Pulse Current on Transient Liquid Phase (TLP) Diffusion Bonding of SiCp/2024Al Composites Sheet Using Mixed Al, Cu, and Ti Powder Interlayer. Metall Mater Trans A 43, 3039–3042 (2012). https://doi.org/10.1007/s11661-012-1315-1

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