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Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Abstract

Microstructural evolution and bonding behavior of transient liquid-phase (TLP) bonded joint for a duplex stainless steel using MBF-30 (Ni-4.5Si-3.2B [wt pct]) and MBF-50 (Ni-7.5Si-1.4B-18.5Cr [wt pct]) were investigated. Using MBF-30, the microstructure of the athermally solidified zone was dependent on B diffusion at 1333.15 K (1060 °C). Ni3B and a supersaturated γ-Ni phase were observed in this zone. BN appeared in the bonding-affected zone. However, using MBF-50, the influences of base metal alloying elements, particularly N and Cr as well as Si in the filler material, on the bond microstructure development were more pronounced at 1448.15 K (1175 °C). BN and (Cr, Ni)3Si phase were present in the bond centerline. The formation of BN precipitates in the bonding-affected zone was suppressed. A significant deviation in the isothermal solidification rate from the conventional TLP bonding diffusion models was observed in the joints prepared at 1448.15 K (1175 °C) using MBF-50.

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Acknowledgments

One of the authors (Xinjian Yuan) gratefully acknowledges the financial provided by the national study-abroad project for postgraduates of key, high-level universities in China. The authors are also grateful for the financial support by the National Core Research Center program from the National Research Foundation of Korea funded by the Ministry of Education, Science and Technology (No. 2010-0001-222).

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Correspondence to Chung Yun Kang.

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Manuscript submitted November 10, 2009.

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Yuan, X., Kim, M.B. & Kang, C.Y. Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials. Metall Mater Trans A 42, 1310–1324 (2011). https://doi.org/10.1007/s11661-010-0534-6

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  • DOI: https://doi.org/10.1007/s11661-010-0534-6

Keywords

  • Duplex Stainless Steel
  • Bonding Temperature
  • Isothermal Solidification
  • High Bonding Temperature
  • Insert Alloy