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Metallurgical and Materials Transactions A

, Volume 40, Issue 2, pp 377–385 | Cite as

On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding

  • M.M. Abdelfatah
  • O.A. OjoEmail author
Article

Abstract

Transient-liquid phase (TLP) bonding of a nickel-based superalloy, IN 738, was performed. Contrary to conventional TLP bonding analytical models, which assume a parabolic relationship between liquid/solid interface migration and holding time, deviation from this law was observed experimentally and by numerical simulation. The deviation, which is caused by reduction in solute concentration gradient below a critical value, is suggested as an alternate phenomenon responsible for anomalous extension of processing time required to produce an eutectic-free joint with increase in bonding temperature. A decrease in the filler gap size and the use of a melting-point depressant (MPD) solute with higher solubility in the base material could reduce the occurrence of the anomalous behavior during a high-temperature TLP joining process.

Keywords

Bonding Temperature Isothermal Solidification Filler Alloy Deviation Zone Parabolic Relationship 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgment

The authors gratefully acknowledge the financial support by the URGP of the University of Manitoba.

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Copyright information

© The Minerals, Metals & Materials Society and ASM International 2008

Authors and Affiliations

  1. 1.Department of Mechanical and Manufacturing EngineeringUniversity of ManitobaWinnipegCanada

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