Thermal stability in bulk cryomilled ultrafine-grained 5083 Al alloy

Abstract

Thermal stability in bulk ultrafine-grained (UFG) 5083 Al that was processed by gas atomization followed by cryomilling, consolidation, and extrusion, and that exhibited an average grain size of 305 nm, was investigated in the temperature range of 473 to 673 K (0.55 to 0.79 T _m , where T _m is the melting temperature of the material) for different annealing times. Appreciable grain growth was observed at temperatures > 573 K, whereas there was limited grain growth at temperatures < 573 K even after long annealing times. The values of the grain growth exponent, n, deduced from the grain growth data were higher than the value of 2 predicted from elementary grain growth theories. The discrepancy was attributed to the operation of strong pinning forces on boundaries during the annealing treatment. An examination of the microstructure of the alloy suggests that the origin of the pinning forces is most likely related to the presence of dispersion particles, which are mostly introduced during cryomilling. Two-grain growth regimes were identified: the low-temperature region (<573 K) and the high-temperature region (>573 K). For temperatures lower than 573 K, the activation energy of 25 ± 5 kJ/mol was determined. It is suggested that this low activation energy represents the energy for the reordering of grain boundaries in the UFG material. For temperatures higher than 573 K, an activation energy of 124 ± 5 kJ/mol was measured. This value of activation energy, 124 ± 5 kJ/mol, lies between that for grain boundary diffusion and lattice diffusion in analogous aluminum polycrystalline systems. The results show that the strength and ductility of bulk UFG 5083 Al, as obtained from tensile tests, correlate well with substructural changes introduced in the alloy by the annealing treatment.