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Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800 °C

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Abstract

The isothermal section of the Sn-Cu-Ni system at 800 °C has been experimentally determined. There is no ternary compound. A solid solution with a very wide compositional range, the γ phase is formed between the Ni3Sn(H) phase and Cu4Sn(H) phase; however, both of these two binary phases are not stable at 800 °C. The binary Ni3Sn2 phase also has extensive ternary solubility. The homogeneity ranges of both the γ and Ni3Sn2 phases are very large in parallel to the Cu-Ni side, but relatively narrow along the Sn direction. This phenomenon indicates that Cu and Ni are exchangeable in both phases. Three kinds of reaction couples, Sn-55 at. pct Cu/Ni, Sn-65 at. pct Cu/Ni, and Sn-75 at. pct Cu/Ni, were prepared and reacted at 800 °C for 5 to 20 minutes. The reaction paths are liquid/Ni3Sn2/γ/Ni3Sn(L)/Ni for the Sn-55 at. pct Cu/Ni and Sn-65 at. pct Cu/Ni couples, and the reaction path is liquid/γ/Ni3Sn(L)/Ni for the Sn-75 at. pct Ni couples.

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References

  1. J.T. Eash and C. Upthegrove: Trans. AIME, 1933, vol. 104, pp. 221–49.

    Google Scholar 

  2. B.D. Bastow and D.H. Kirkwood: J. Inst. Met., 1971, vol. 99, pp. 277–83.

    CAS  Google Scholar 

  3. Y. Murakami and S. Kachi: Trans. JIM, 1983, vol. 24 (1), pp. 9–17.

    CAS  Google Scholar 

  4. M. Miki and Y. Ogino: Trans. JIM, 1984, vol. 2 (9), pp. 593–602.

    Google Scholar 

  5. E. Wachtel and E. Bayer: Z. Metallkd., 1984, vol. 75, pp. 61–69.

    CAS  Google Scholar 

  6. K.P. Gupta: Ind. Inst. Met., 1990, vol. 1, pp. 195–218.

    Google Scholar 

  7. C.-H. Lin, S.-W. Chen, and C.-H. Wang: J. Electronic Mater., 2002, vol. 31 (9), pp. 907–15.

    Article  CAS  Google Scholar 

  8. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang: JOM, 2001, vol. 53 (6), p. 28.

    CAS  Google Scholar 

  9. W.T. Chen, C.E. Ho, and C.R. Kao: J. Mater. Res., 2002, vol. 17 (2), pp. 263–66.

    CAS  Google Scholar 

  10. N. Saunders and A.P. Miodownik: Binary Alloy Phase Diagrams, 2nd ed., T.B. Massalski, ed., ASM, Materials Park, 1990, pp. 1481–83.

    Google Scholar 

  11. P. Nash and A. Nash: Binary Alloy Phase Diagrams, 2nd ed., T.B. Massalski, ed., ASM, Materials Park, 1990, pp. 2863–64.

    Google Scholar 

  12. D.J. Charkrabarti, D.E. Laughlin, S.-W. Chen, and Y.A. Chang: Binary Alloy Phase Diagrams, 2nd ed., T.B. Massalski, ed., ASM, Materials Park, 1990, pp. 1442–45.

    Google Scholar 

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Authors and Affiliations

  1. the Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300 R.O.C.

    Chao-Hong Wang (Graduate Student) & Sinn-Wen Chen (Professor)

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  1. Chao-Hong Wang
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  2. Sinn-Wen Chen
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Wang, CH., Chen, SW. Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800 °C. Metall Mater Trans A 34, 2281–2287 (2003). https://doi.org/10.1007/s11661-003-0292-9

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  • DOI: https://doi.org/10.1007/s11661-003-0292-9

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