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Microstructural effects on moisture-induced embrittlement of isothermally forged TiAl-based intermetallic alloys

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Abstract

By using isothermally forged TiAl-based intermetallic alloys, various microstructures (of γ-grain, duplex, dual-phase, and fully lamellar microstructures) were prepared. These TiAl-based intermetallic alloys were tensile tested in vacuum and air as functions of strain rate and temperature to investigate microstructural effects on the moisture-induced embrittlement. All the intermetallic alloys with different microstructures showed different levels of reduced tensile stress (or elongation) in air at room temperature. The reduction in tensile stress (or elongation) due to testing in air diminishes as the testing temperature (or strain-rate) increases. From the fracture stress-temperature curves, it was found that the γ-grain microstructure was the most resistant to the moisture-induced embrittlement, and the dual-phase microstructure was the most susceptible to the moisture-induced embrittlement. Also, the moisture-induced embrittlement of the TiAl-based intermetallic alloys with a fully lamellar microstructure depends on the lamellar spacing and is reduced with decreasing lamellar spacing. The possible reasons for the observed microstructural effect on the moisture-induced embrittlement were discussed, in association with hydrogen behavior and properties in the constituent phases and at some interfaces.

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Authors and Affiliations

  1. the Department of Metallurgy and Materials Science, Graduate School of Engineering, Osaka Prefecture University, 599-8531, Sakai, Osaka, Japan

    T. Tsuyumu (Graduate Student), Y. Kaneno (Research Associate), H. Inoue (Associate Professor) & T. Takasugi (Professor)

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  1. T. Tsuyumu
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  2. Y. Kaneno
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  3. H. Inoue
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  4. T. Takasugi
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Tsuyumu, T., Kaneno, Y., Inoue, H. et al. Microstructural effects on moisture-induced embrittlement of isothermally forged TiAl-based intermetallic alloys. Metall Mater Trans A 34, 645–655 (2003). https://doi.org/10.1007/s11661-003-0099-8

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  • DOI: https://doi.org/10.1007/s11661-003-0099-8

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