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Interface nanochemistry effects on stainless steel diffusion bonding

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Abstract

The diffusion-bonding behavior of single-phase austenitic stainless steel depends strongly on the chemistry of the surfaces to be bounded. We found that very smooth (0.5 nm root-mean-square (RMS) roughness), mechanically polished and lapped substrates would bond completely in ultrahigh vacuum (UHV) in 1 hour at 1000 °C under 3.5 MPa uniaxial pressure, if the native oxide on the substrates was removed by ion-beam cleaning, as shown by in-situ Auger analysis. No voids were observed in these bonded interfaces by transmission electron microscopy (TEM), and the strength was equal to that of the unbounded bare material. No bond formed between the substrates if in-situ ion cleaning was not used. The rougher cleaned substrates partially bonded, indicating that roughness, as well as native oxides, reduced the bonding kinetics.

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Authors and Affiliations

  1. the Center for Solid State Science, Science and Engineering of Materials, Arizona State University, 85287-1704, Tempe, AZ

    M. J. Cox (Graduate Student) & R. W. Carpenter (Professor)

  2. the Department of Materials Science, University of North Texas, 76203, Denton, TX

    M. J. Kim (Professor)

Authors
  1. M. J. Cox
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  2. R. W. Carpenter
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  3. M. J. Kim
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Cox, M.J., Carpenter, R.W. & Kim, M.J. Interface nanochemistry effects on stainless steel diffusion bonding. Metall Mater Trans A 33, 437–442 (2002). https://doi.org/10.1007/s11661-002-0104-7

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  • DOI: https://doi.org/10.1007/s11661-002-0104-7

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