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Strength and ductility of heavily drawn bundled Cu-Nb filamentary microcomposite wires with various Nb contents

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Abstract

The strength and ductility of heavily drawn bundled Cu-Nb filamentary microcomposite was examined as a function of Nb content. In order to predict the variation of the yield strength (YS) with Nb content, the interfilamentary spacing was calculated as a function of Nb content based on the assumption that Nb filaments are distributed regularly along the sides of a triangular unit cell in the transverse section. The yield stress can be described as the sum of the substructure strengthening component due to elongated grains, subgrains and/or cells, the phase boundary strengthening term associated with the Hall-Petch type interaction between dislocations and phase boundaries, and the precipitate strengthening component. The contributions from phase boundary strengthening, σ PB (Cu-Nb), and precipitate strengthening, σ ppt, increase with increasing Nb content. However, the contribution from substructure strengthening, σ sub (Cu-Nb), decreases with increasing Nb content since more grain or subgrain boundaries are absorbed at Cu/Nb phase boundaries with increasing Nb content. The good agreement between the prediction and the experimental data suggests that the increase of the strength in Cu-Nb filamentary microcomposite with increasing Nb content results mostly from an increasing volume fraction of Nb filaments, which act as barriers to plastic flow.

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Authors and Affiliations

  1. the Department of Metallurgical Engineering, Chungnam National University, 305-764, Taejon, Korea

    S. I. Hong (Associate Professor) & H. S. Kim (Assistant Professor)

  2. Los Alamos National Laboratory, the Materials Science Division, 87545, Los Alamos, NM

    M. A. Hill (Staff Member)

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  1. S. I. Hong
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  2. H. S. Kim
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  3. M. A. Hill
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Hong, S.I., Kim, H.S. & Hill, M.A. Strength and ductility of heavily drawn bundled Cu-Nb filamentary microcomposite wires with various Nb contents. Metall Mater Trans A 31, 2457–2462 (2000). https://doi.org/10.1007/s11661-000-0191-2

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  • DOI: https://doi.org/10.1007/s11661-000-0191-2

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