Skip to main content
Log in

Heat Transfer Performance of Microgroove Back Plate Heat Pipes with Working Fluid and Heating Power

  • Published:
Journal of Thermal Science Aims and scope Submit manuscript

Abstract

Micro heat pipes (MHP) cooling is one of the most efficient solutions to radiate heat for high heat flux electronic components in data centers. It is necessary to improve heat transfer performance of microgroove back plate heat pipes. This paper discusses about influence on thermal resistance through experiments and numerical simulation with different working fluids, filling ratio and heat power. Thermal resistance of the CO2 filled heat pipe is 14.8% lower than the acetone filled heat pipe. In the meantime, at the best filling ratio of 40%, the CO2 filled heat pipe has the optimal heat transfer behavior with the smallest thermal resistance of 0.123 K/W. The thermal resistance continues to decline but the magnitude of decreases is going to be minor. In addition, this paper illustrates methods about how to enhance heat pipe performance from working fluids, filling ratio and heat power, which provides a theoretical basis for practical applications.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. Gu L.J., Yang H.W., Hu S., US data center energy saving experience and enlightenment. China Energy, 2015, 37(06): 26–29+21. (in Chinese)

    Google Scholar 

  2. Noie S.H., Heat transfer characteristics of a two-phase closed thermo syphon. Applied Thermal Engineering, 2005, 25(4): 495–506.

    Article  Google Scholar 

  3. Elnaggar H.A., Abdullah M.Z., Mujeebu M.A., Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling. Energy Conversion and Management, 2011, 52: 2937–2944.

    Article  Google Scholar 

  4. Elnaggar H.A., Abdullah M.Z., Mujeebu M.A., Characterization of working fluid in vertically mounted finned U-shape twin heat pipe for electronic cooling. Energy Conversion and Management, 2012, 62: 31–39.

    Article  Google Scholar 

  5. Rao Z.H., Wang S.F., Wu M.H., Lin Z.R., Li F.H., Experimental investigation on thermal management of electric vehicle battery with heat pipe. Energy Conversion and Management, 2013, 65: 92–97.

    Article  Google Scholar 

  6. Vasiliev L.L., Heat pipes in modern heat exchangers. Applied Thermal Engineering, 2005, 25(1): 1–19.

    Article  MathSciNet  Google Scholar 

  7. Wang Y., Vafai K., An experimental investigation of the thermal performance of an asymmetrical flat plate heat pipe. International Journal of Heat and Mass Transfer, 2000, 43(15): 2657–2668.

    Article  Google Scholar 

  8. Hsieh S.S., Lee R.Y., Shyu J.C., Chen S.W., Thermal performance of flat vapor chamber heat spreader. Energy Conversion and Management, 2008, 49(6): 1774–1784.

    Article  Google Scholar 

  9. Hsieh S.S., Yang Y.R., Design, fabrication and performance tests for a polymer based flexible flat heat pipe. Energy Conversion and Management, 2013, 70: 10–19.

    Article  Google Scholar 

  10. Hsieh S.S., Lee R.Y., Shyu J.C., Chen S.W., Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar. Energy Conversion and Management, 2007, 48(10): 2708–2717.

    Article  Google Scholar 

  11. Hamideh S., Saeed Z.H., Ali A., Mohammad P.F., Experimental investigation of a novel type of two-phase closed thermo syphon filled with functionalized carbon nanotubes/water nanofluids for electronic cooling application. Energy Conversion and Management, 2019, 188: 321–332.

    Article  Google Scholar 

  12. Noie S.H., Heris S.Z., Kahani M., et al, Heat transfer enhancement using Al2O3/water nanofluid in a two-phase closed thermo syphon. International Journal of Heat and Fluid Flow, 2009, 30(4): 700–705.

    Article  Google Scholar 

  13. Lips S., Lefèvre F., Bonjour J., Nucleate boiling in a flat grooved heat pipe. International Journal of Thermal Sciences, 2009, 48(7): 1273–1278.

    Article  Google Scholar 

  14. Bai L.N., Su X.J., Ren W.H., Yang W.Z., Effect of vacuum on heat transfer performance of pulsating heat pipe. Cryogenics and Superconductivity, 2019, 47(04): 62–66. (in Chinese)

    Google Scholar 

  15. Qu J., Peng Y.Q., Sun Q., Heat transfer characteristics of compact three-dimensional pulsating heat pipe with flat evaporator. Journal of Chemical Engineering, 2018, 69(07): 2899–2907. (in Chinese)

    Google Scholar 

  16. Kuang X., Wei W., Yang W., Xie X.Z., Hu W. Study on factors affecting heat transfer performance of groove micro heat pipes. Low temperature and superconductivity, 2018, 46(03): 58–63. (in Chinese)

    Google Scholar 

  17. Hou Y.P., Cui W.Z., Nie X., Xie Z.W., Experimental study on heat transfer performance of non-uniform groove flat heat pipe. Journal of Chongqing University, 2018, 41(03): 13–20. (in Chinese)

    Google Scholar 

  18. Fan C.L., Qu W., Sun F.R., Experimental study on heat transfer performance of three kinds of microgroove structure flat heat pipes. Electronic Devices, 2003, 26(4): 357–360. (in Chinese)

    Google Scholar 

  19. Wang S., Chen J., Hu Y., et al., Effect of evaporation section and condensation section length on thermal performance of flat plate heat pipe. Applied Thermal Engineering, 2011, 31(14): 2367–2373.

    Article  Google Scholar 

  20. Wang C., Liu Z.L., Zhang G.M., et al., Experimental study on the influence of tilt angle on the performance of flat plate heat pipe. Journal of Engineering Thermophysics, 2012, 33(008): 1400–1402. (in Chinese)

    Google Scholar 

  21. Chen J.S., Chou J.H., Cooling performance of flat plate heat pipes with different liquid filling ratios. International Journal of Heat and Mass Transfer, 2014, 77: 874–882.

    Article  Google Scholar 

  22. Peng H., Li J., Ling X., Study on heat transfer performance of an aluminum flat plate heat pipe with fins in vapor chamber. Energy Conversion and Management, 2013, 74: 44–50.

    Article  Google Scholar 

  23. Heris S.Z., Edalati Z., Noie S.H., et al., Experimental investigation of Al2O3/Water Nanofluid through equilateral triangular duct with constant wall heat flux in laminar flow. Heat Transfer Engineering, 2014, 35(13): 1173–1182.

    Article  ADS  Google Scholar 

  24. Zhao Y.H., Wang H.Y., Diao Y.H., Wang X.Y., Deng Y.C., Flat plate micro heat pipe array and its heat transfer characteristics. Journal of chemical industry, 2011, 62(02): 336–343. (in Chinese)

    Google Scholar 

Download references

Acknowledgements

The authors gratefully acknowledge the financial support for this research through the Beijing Natural Science Foundation (No. 8202034) and the USTB-NTUT Joint Research Program.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Yanpeng Wu.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wu, Y., Jia, J., Tian, D. et al. Heat Transfer Performance of Microgroove Back Plate Heat Pipes with Working Fluid and Heating Power. J. Therm. Sci. 29, 982–991 (2020). https://doi.org/10.1007/s11630-020-1336-9

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11630-020-1336-9

Keywords

Navigation