Abstract
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.
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Maruvada P S, Dallaire R D, Pedneault R. Development of field-mill instruments for ground-level and above-ground electric field measurement under HVDC transmission lines. IEEE Transactions on Power Apparatus and Systems, 1983, PAS-102(3): 738–744
Yang P, Chen B, Wen X, et al. A novel MEMS chip-based atmospheric electric field sensor for lightning hazard warning applications. In: Proceedings of IEEE Sensors. Busan: IEEE, 2015, 1–4
Wooi C L, Abdul-Malek Z, Ahmad N A, et al. Statistical analysis of electric field parameters for negative lightning in Malaysia. Journal of Atmospheric and Solar-Terrestrial Physics, 2016, 146: 69–80
Kasaba Y, Hayakawa H, Ishisaka K, et al. Evaluation of DC electric field measurement by the double probe system aboard the Geotail spacecraft. Advances in Space Research, 2006, 37(3): 604–609
Vaivads A, Eriksson A I, André M, et al. Low-frequency electric field and density fluctuation measurements on Solar Orbiter. Advances in Space Research, 2007, 39(9): 1502–1509
Pedersen A, Cattell C A, Fälthammar C G, et al. Quasistatic electric field measurements with spherical double probes on the GEOS and ISEE satellites. Space Science Reviews, 1984, 37(3–4): 269–312
Tant P, Bolsens B, Sels T, et al. Design and application of a field mill as a high-voltage DC meter. IEEE Transactions on Instrumentation and Measurement, 2007, 56(4): 1459–1464
Mathews S, Farrell G, Semenova Y. All-fiber polarimetric electric field sensing using liquid crystal infiltrated photonic crystal fibers. Sensors and Actuators A: Physical, 2011, 167(1): 54–59
Zhu T, Ou Z, Han M, et al. Propylene carbonate based compact fiber Mach-Zehnder interferometric electric field sensor. Journal of Lightwave Technology, 2013, 31(10): 1566–1572
Toney J E, Tarditi A G, Pontius P, et al. Detection of energized structures with an electro-optic electric field sensor. IEEE Sensors Journal, 2014, 14(5): 1364–1369
Hsu C H, Muller R S. Micromechanical electrostatic voltmeter. In: Proceedings of International Conference on Solid-State Sensors and Actuators. San Francisco: IEEE, 1991, 659–662
Horenstein M N, Stone P R. A micro-aperture electrostatic field mill based on MEMS technology. Journal of Electrostatics, 2001, 51–52: 515–521
Riehl P S, Scott K L, Muller R S, et al. Electrostatic charge and field sensors based on micromechanical resonators. Journal of Microelectromechanical Systems, 2003, 12(5): 577–589
Peng C, Chen X, Ye C, et al. Design and testing of a micromechanical resonant electrostatic field sensor. Journal of Micromechanics and Microengineering, 2006, 16(5): 914–919
Lundberg K H, Shafran J S, Kuang J, et al. A self-resonant MEMSbased electrostatic field sensor. In: Proceedings of the 2006 American Control Conference. Minneapolis: IEEE, 2006, 1221–1226
Chen X, Peng C, Tao H, et al. Thermally driven micro-electrostatic fieldmeter. Sensors and Actuators A: Physical, 2006, 132(2): 677–682
Bahreyni B, Wijeweera G, Shafai C, et al. Analysis and design of a micromachined electric-field sensor. Journal of Microelectromechanical Systems, 2008, 17(1): 31–36
Ghionea S, Smith G, Pulskamp J, et al. MEMS electric-field sensor with lead zirconate titanate (PZT)-actuated electrodes. In: Proceedings of 2013 IEEE Sensors. Baltimore: IEEE, 2013, 1–4
Yang P, Peng C, Fang D, et al. Design, fabrication and application of an SOI-based resonant electric field microsensor with coplanar comb-shaped electrodes. Journal of Micromechanics and Microengineering, 2013, 23(5): 055002
Wang Y, Fang D, Feng K, et al. A novel micro electric field sensor with X-Y dual axis sensitive differential structure. Sensors and Actuators A: Physical, 2015, 229: 1–7
Gao Z, Yu Z, Zeng R, et al. Research on measuring methods and sensors of high voltage DC electric field. In: Proceedings of International Conference on Information Science, Electronics and Electrical Engineering (ISEEE). Sapporo: IEEE, 2014, 850–854
Li C, Shen X, Zeng R. Optical electric-field sensor based on angular optical bias using single ß-BaB2O4 crystal. Applied Optics, 2013, 52 (31): 7580–7585
Wen X, Fang D, Peng C, et al. Three dimensional electric field measurement method based on coplanar decoupling structure. In: Proceedings of 2014 IEEE Sensors. Valencia: IEEE, 2014, 582–585
Fang Y, Peng C, Fang D, et al. Micro 3-dimensional folding electric field sensor. Transducer and Microsystem Technologies, 2016, 35 (5): 67–73 (in Chinese)
Yeh J A, Chen C, Lui Y. Large rotation actuated by in-plane rotary comb-drives with serpentine spring suspension. Journal of Micromechanics and Microengineering, 2005, 15(1): 201–206
Allen C, Ramaswamy M, Stafford J, et al. MetalMUMPs Design Handbook, Revision 4.0, 2006
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This work was supported by the National Natural Science Foundation of China (Grant No. 61327810) and the National High Technology Research and Development Program of China (863 Project) (Grant No. 2015AA042602).
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Ling, B., Wang, Y., Peng, C. et al. Single-chip 3D electric field microsensor. Front. Mech. Eng. 12, 581–590 (2017). https://doi.org/10.1007/s11465-017-0454-x
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DOI: https://doi.org/10.1007/s11465-017-0454-x