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Flow behavior of liquid-solid coupled system of piezoelectric micropump

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Abstract

This paper employs a shallow water model and the finite element method to approximate periodical flows of a micropump to a two-dimensional thickness-averaged flow. A liquid-solid coupled system equation of the micropump is presented. Through the mode analysis of the liquid-solid coupled system, the first-order natural frequency, diaphragm vibration shape and amplitude-frequency relationship are obtained. The vibration response of the diaphragm is calculated when an external electric field is applied. Based on the thickness-averaged flow equation, the periodical flow of the micropump is studied using the finite volume method to investigate the flow behavior and flow rate-frequency characteristics. Numerical results indicate that an optimal working frequency can be obtained, at which the flow rate of the micropump achieves the maximum when the external electric voltage is fixed.

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References

  1. Tay F E H. Microfluidics and bioMEMS applications, Boston: Kluwer Academic Publishers, 2002, 1st Edition

    Google Scholar 

  2. Stemme E, Stemme G. A valve-less diffuser/nozzle-based fluid pump. Sensors and Actuators A, 1993, 39(2): 159–167

    Article  Google Scholar 

  3. Laser D J, Santiago J G. A review of micropumps. J Micromech Microeng. 2004, 14(I.6): 35–64

    Article  Google Scholar 

  4. Vishal S, Suresh V, Garimella J. et al. Low Reynolds number flow Through nozzle-diffuser elements in valveless micropumps. Sensors and Actuators A, 2004, 113(2): 94–103

    Google Scholar 

  5. Michael K, Alan E. Microfluidics technology and application. Research Studies Press Ltd, 2000, 1st Edition

  6. Olsson A, Stemme G, Stemme E. A valve-less planer fluid pump with two chambers. Sensors and Actuators A, 1995, 46(3): 549–556

    Article  Google Scholar 

  7. Ullmann A, Fono I, Taitel Y. A piezoelectric valve-less pump-dynamic model. Journal of Fluids Engineering, 2001, 23(I.1): 92–97

    Article  Google Scholar 

  8. Ullmann A, Fono I. The piezoelectric valve-less pump — improved dynamic model. Journal of Microelectromechanical Systems, 2002, 11(I.6): 655–664

    Article  Google Scholar 

  9. Olsson A, Stemme G, Stemme E. A numerical design study of the valveless diffuser pump using a lumped-mass modal. J Micromech MicroEng, 1999, 9(I.1): 34–44

    Article  Google Scholar 

  10. Ullman A. The piezoelectric valve-less pump-performance enhancement analysis. Sensors And Actuators A, 1998, 69(I.1): 97–105

    Article  Google Scholar 

  11. Pan L S, Ng T Y, Liu G R. Analytical solutions for the dynamic analysis of a valveless micropump—a fluid-membrane coupling study. Sensors and Actuators A, 2001, 93(2): 173–181

    Article  Google Scholar 

  12. Zhang Y L, Wu J K. Numerical study of periodical flows of piezoelectric valveless micropump for biochips. Applied Math And Mech, 2005, 26(8): 1026–1033

    Article  Google Scholar 

  13. Wang P, Han Z X, Zhang J Y. Complete Handbook of Fluid Mechanics. Beijing: Beijing University of Aeronautics and Astronautics, 1991

    Google Scholar 

  14. Wu J K, Lu L J. Liquid-Solid coupled system of micropumps. Acta Mechanica Solida, 2006, 18(4): 301–308

    Google Scholar 

Download references

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Correspondence to Jiankang Wu.

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Translated from Journal of Hydrodynamics, 2006, 21(4): 512–518 [译自: 水动力学研究与进展]

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Lu, L., Wu, J. Flow behavior of liquid-solid coupled system of piezoelectric micropump. Front. Mech. Eng. China 3, 50–54 (2008). https://doi.org/10.1007/s11465-008-0003-8

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  • DOI: https://doi.org/10.1007/s11465-008-0003-8

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