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Residual stress of physical vapor-deposited polycrystalline multilayers

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Abstract

An extended one-dimensional stress model for the deposition of multilayer films is built based on the existing stress model by considering the influence of deposition conditions. Both thermal stress and intrinsic stress are considered to constitute the final residual stress in the model. The deposition process conditions such as deposition temperature, oxygen pressure, and film growth rate are correlated to the full stress model to analyze the final residual stress distribution, and thus the deformation of the deposited multilayer system under different process conditions. Also, the model is numerically realized with in-house built code. A deposition of Ag-Cu multilayer system is simulated with the as-built extended stress model, and the final residual stresses under different deposition conditions are discussed with part of the results compared with experiment from other literature.

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Authors and Affiliations

  1. School of Aerospace, Tsinghua University, Beijing, 100084, China

    Song Zhang & LiLi Zheng

  2. Department of Engineering Physics, Tsinghua University, Beijing, 100084, China

    Hui Zhang

Authors
  1. Song Zhang
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  2. Hui Zhang
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  3. LiLi Zheng
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Correspondence to LiLi Zheng.

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Zhang, S., Zhang, H. & Zheng, L. Residual stress of physical vapor-deposited polycrystalline multilayers. Sci. China Phys. Mech. Astron. 58, 1–9 (2015). https://doi.org/10.1007/s11433-014-5595-x

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  • DOI: https://doi.org/10.1007/s11433-014-5595-x

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