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Communication and performance evaluation of 3-ary n-cubes onto network-on-chips

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  1. Xiang D, Chakrabarty K, Fujiwara H. Multicast-based testing and thermal-aware test scheduling for 3D ICs with a stacked Network-on-Chip. IEEE Trans Comput, 2016, 65: 2767–2779

    MathSciNet  Article  Google Scholar 

  2. Xiang D, Shen K. A new unicast-based multicast scheme for Network-on-Chip router and interconnect testing. ACM Trans Desi Auto of Elec Syst, 2016, 21: 1–24

    Article  Google Scholar 

  3. Chittamuru S V R, Dang D, Pasricha S, et al. BiGNoC: accelerating big data computing with application-specific photonic Network-on-Chip architectures. IEEE Trans Parallel Distrib Syst, 2018, 29: 2402–2415

    Article  Google Scholar 

  4. Gu H, Chen K, Yang Y, et al. MRONoC: a low latency and energy efficient on chip optical interconnect architecture, IEEE Phot J, 2017, 9: 1–12

    Google Scholar 

  5. Gu H, Wang Z, Zhang B, et al. Time-division-multiplexing-wavelength-division-multiplexing-based architecture for ONoC. IEEE/OSA J Opt Commu and Netw, 2017, 9: 351–363

    Article  Google Scholar 

  6. Yang Y, Chen K, Gu H, et al. TAONoC: a regular passive optical Network-on-Chip architecture based on comb switches. IEEE Trans VLSI Syst, 2019, 27: 954–963

    Article  Google Scholar 

  7. Chuah E, Jhumka A, Alt S, et al. Towards comprehensive dependability-driven resource use and message log-analysis for HPC systems diagnosis. J Parall Distrib Comput, 2019, 132: 95–112

    Article  Google Scholar 

  8. Fan W B, Fan J X, Lin C K, et al. Optimally embedding 3-Ary n-Cubes into grids. J Comput Sci Technol, 2019, 34: 372–387

    MathSciNet  Article  Google Scholar 

  9. Sundara R R, Rajasingh I, Parthiban N, et al. A linear time algorithm for embedding hypercube into cylinder and torus. Theor Comput Sci, 2014, 542: 108–115

    MathSciNet  Article  Google Scholar 

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This work was supported by National Natural Science Foundation of China (Grant Nos. U1905211, 61672296, 61872194, 61972272), National Key R&D Program of China (Grant No. 2018YFB1003201), and NUPTSF (Grant No. NY219151).

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Correspondence to Jianxi Fan.

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Fan, W., Fan, J., Zhang, Y. et al. Communication and performance evaluation of 3-ary n-cubes onto network-on-chips. Sci. China Inf. Sci. 65, 179101 (2022).

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