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An introduction to CPU and DSP design in China

中国处理器和数字信号处理芯片设计介绍

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Abstract

In recent years, China has witnessed considerable achievements in the production of domesticallydesigned CPUs and DSPs. Owing to fifteen years of hard work that began in 2001, significant progress has been made in Chinese domestic CPUs and DSPs, primarily represented by Loongson and ShenWei processors. Furthermore parts of the CPU design techniques are comparable to the world’s most advanced designs. A special issue published in Scientia Sinica Informationis in April 2015, is dedicated to exhibiting the technical advancements in Chinese domestically-designed CPUs and DSPs. The content in this issue describes the design and optimization of high performance processors and the key technologies in processor development; these include high-performance micro-architecture design, many-core and multi-core design, radiation hardening design, highperformance physical design, complex chip verification, and binary translation technology. We hope that the articles we collected will promote understanding of CPU/DSP progress in China. Moreover, we believe that the future of Chinese domestic CPU/DSP processors is quite promising.

创新点

文章总结了设计和优化国产高性能处理器的关键技术,其中包括高性能微构架设计,多核设计,抗辐射加固设计,高性能物理设计,复杂芯片验证方法,二进制翻译技术。展示了中国自主研发处理器和数字信号处理芯片的技术先进性。

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Authors and Affiliations

  1. State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, 100190, China

    Weiwu Hu, Yifu Zhang & Jie Fu

  2. Institute of Computing Technology, Chinese Academy of Sciences, Beijing, 100190, China

    Weiwu Hu, Yifu Zhang & Jie Fu

  3. School of Computer and Control Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China

    Yifu Zhang & Jie Fu

  4. Loongson Technology Corporation Limited, Beijing, 100195, China

    Weiwu Hu

Authors
  1. Weiwu Hu
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  2. Yifu Zhang
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  3. Jie Fu
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Correspondence to Jie Fu.

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Hu, W., Zhang, Y. & Fu, J. An introduction to CPU and DSP design in China. Sci. China Inf. Sci. 59, 1–8 (2016). https://doi.org/10.1007/s11432-015-5431-6

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