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Compressive elastic behavior of single-crystalline 4H-silicon carbide (SiC) nanopillars

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Abstract

As a wide-bandgap semiconductor, 4H-SiC is an ideal material for high-power and high-frequency devices, and plays an increasingly important role in developing our country’s future electric vehicles and 5G techniques. Practical applications of SiC-based devices largely depend on their mechanical performance and reliability at the micro- and nanoscales. In this paper, single-crystal [0001]-oriented 4H-SiC nanopillars with the diameter ranging from ~200 to 700 nm were microfabricated and then characterized by in situ nanomechanical testing under SEM/TEM at room temperature. Loading-unloading compression tests were performed, and large, fully reversible elastic strain up to ~6.2% was found in nanosized pillars. Brittle fracture still occurred when the max strain reached ~7%, with corresponding compressive strength above 30 GPa, while in situ TEM observation showed few dislocations activated during compression along the [0001] direction. Besides robust microelectromechanical system (MEMS), flexible device and nanocomposite applications, the obtained large elasticity in [0001]-oriented 4H-SiC nanopillars can offer a fertile opportunity to modulate their electron mobility and bandgap structure by nanomechanical straining, the so called “elastic strain engineering”, for novel electronic and optoelectronic applications.

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References

  1. Harris G. Properties of silicon carbide, INSPEC. London: The Institution of Electrical Engineers, 1995, 5

    Google Scholar 

  2. Katoh Y, Snead L L, Henager Jr. C H, et al. Current status and critical issues for development of SiC composites for fusion applications. J Nucl Mater, 2007, 367–370: 659–671

    Google Scholar 

  3. Hinoki T, Katoh Y, Snead L L, et al. Silicon carbide and silicon carbide composites for fusion reactor application. Mater Trans, 2013, 54: 472–476

    Google Scholar 

  4. Ledoux M J, Pham-Huu C. Silicon carbide: A novel catalyst support for heterogeneous catalysis. Cattech, 2001, 5: 226–246

    Google Scholar 

  5. Iveković A, Novak S, Dražić G, et al. Current status and prospects of SiCf/SiC for fusion structural applications. J Eur Ceramic Soc, 2013, 33: 1577–1589

    Google Scholar 

  6. Wright N G, Horsfall A B, Vassilevski K. Prospects for SiC electronics and sensors. Mater Today, 2008, 11: 16–21

    Google Scholar 

  7. Jepps N W, Page T F. Polytypic transformations in silicon carbide. Prog Cryst Growth Charact, 1983, 7: 259–307

    Google Scholar 

  8. Chen B, Matsuhata H, Sekiguchi T, et al. Pinning of recombination-enhanced dislocation motion in 4H-SiC: Role of Cu and EH1 complex. Appl Phys Lett, 2010, 96: 212110

    Google Scholar 

  9. Chen B, Sekiguchi T, Ohyanagi T, et al. Evidence for a general mechanism modulating carrier lifetime in SiC. Phys Rev B, 2010, 81: 233203

    Google Scholar 

  10. Fissel A. Artificially layered heteropolytypic structures based on SiC polytypes: Molecular beam epitaxy, characterization and properties. Phys Rep, 2003, 379: 149–255

    Google Scholar 

  11. Ha S, Skowronski M, Sumakeris J J, et al. Driving force ofstacking-fault formation in SiC p–i–n diodes. Phys Rev Lett, 2004, 92: 175504

    Google Scholar 

  12. Galeckas A, Linnros J, Pirouz P. Recombination-induced stacking faults: Evidence for a general mechanism in hexagonal SiC. Phys Rev Lett, 2006, 96: 025502

    Google Scholar 

  13. Skowronski M, Ha S. Degradation ofhexagonal silicon-carbide-based bipolar devices. J Appl Phys, 2006, 99: 011101

    Google Scholar 

  14. Fabbri F, Rossi F, Melucci M, et al. Optical properties of hybrid T3Pyr/SiO2/3C-SiC nanowires. Nanoscale Res Lett, 2012, 7: 680

    Google Scholar 

  15. Chen B, Matsuhata H, Kumagai K, et al. Direct imaging and optical activities of stacking faults in 4H-SiC homoepitaxial films. J Appl Phys, 2012, 111: 053513

    Google Scholar 

  16. Wright N G, Horsfall A B. SiC sensors: A review. J Phys D-Appl Phys, 2007, 40: 6345–6354

    Google Scholar 

  17. Pirouz P, Demenet J L, Hong M H. On transition temperatures in the plasticity and fracture of semiconductors. Philos Mag A, 2001, 81: 1207–1227

    Google Scholar 

  18. Chen B, Wang J, Zhu Y, et al. Deformation-induced phase transformation in 4H–SiC nanopillars. Acta Mater, 2014, 80: 392–399

    Google Scholar 

  19. Guo X, Guo Q, Li Z, et al. Size and crystallographic orientation effects on the mechanical behavior of4H-SiC micro-/nano-pillars. Metall Mat Trans A, 2018, 49: 439–445

    Google Scholar 

  20. Minor A M, Syed Asif S A, Shan Z, et al. A new view of the onset of plasticity during the nanoindentation of aluminium. Nat Mater, 2006, 5: 697–702

    Google Scholar 

  21. Vashishta P, Kalia R K, Nakano A, et al. Interaction potential for silicon carbide: A molecular dynamics study of elastic constants and vibrational density of states for crystalline and amorphous silicon carbide. J Appl Phys, 2007, 101: 103515

    Google Scholar 

  22. Zhao F, Du W, Huang C F. Fabrication and characterization of single-crystal 4H-SiC microactuators for MHz frequency operation and determination of Young’s modulus. Microelectron Eng, 2014, 129: 53–57

    Google Scholar 

  23. Zhang H, Tersoff J, Xu S, et al. Approaching the ideal elastic strain limit in silicon nanowires. Sci Adv, 2016, 2: e1501382

    Google Scholar 

  24. Kitahara H, Noda Y, Yoshida F, et al. Mechanical behavior of single crystalline and polycrystalline silicon carbides evaluated by Vickers indentation. J Ceram Soc Japan, 2001, 109: 602–606

    Google Scholar 

  25. Syväjärvi M, Yakimova R, Janzén E. Cross-sectional cleavages of SiC for evaluation of epitaxial layers. J Cryst Growth, 2000, 208: 409–415

    Google Scholar 

  26. Goel S. The current understanding on the diamond machining of silicon carbide. J Phys D-Appl Phys, 2014, 47: 243001

    Google Scholar 

  27. Kunka C, Trachet A, Subhash G. Interaction of indentation-induced cracks on single-crystal silicon carbide. J Am Ceramic Soc, 2015, 98: 1891–1897

    Google Scholar 

  28. Lara A, Castillo-Rodríguez M, Muñoz A, et al. Dislocation micro-structure of 4H–SiC single crystals plastically deformed around the transition temperature. J Eur Ceramic Soc, 2012, 32: 495–502

    Google Scholar 

  29. Lu C, Danzer R, Fischer F D. Scaling of fracture strength in ZnO: Effects of pore/grain-size interaction and porosity. J Eur Ceramic Soc, 2004, 24: 3643–3651

    Google Scholar 

  30. Lu C, Danzer R, Fischer F D. Fracture statistics of brittle materials: Weibull or normal distribution. Phys Rev E, 2002, 65: 067102

    Google Scholar 

  31. Cheng G, Chang T H, Qin Q, et al. Mechanical properties of silicon carbide nanowires: Effect of size-dependent defect density. Nano Lett, 2014, 14: 754–758

    Google Scholar 

  32. Kiani S, Leung K W K, Radmilovic V, et al. Dislocation glide-controlled room-temperature plasticity in 6H-SiC single crystals. Acta Mater, 2014, 80: 400–406

    Google Scholar 

  33. Fujita S, Matsuyama T. Experimental tinea pedis induced by non-abrasive inoculation of Trichophyton mentagrophytes arthrospores on the plantar part of a guinea pig foot. Med Mycol, 1987, 25: 203–213

    Google Scholar 

  34. Suematsu H, Suzuki T, Iseki T, et al. Kinking and cracking caused by slip in single crystals of silicon carbide. J Am Ceramic Soc, 1991, 74: 173–178

    Google Scholar 

  35. Zhang M, McD. Hobgood H, Pirouz P. Deformation of 4H-SiC single crystals oriented for prism slip. MSF, 2004, 457–460: 371–374

    Google Scholar 

  36. Lee J W, Skowronski M, Sanchez E K, et al. Origin of basal plane bending in hexagonal silicon carbide single crystals. J Cryst Growth, 2008, 310: 4126–4131

    Google Scholar 

  37. Zhang H, Fung K Y, Zhuang Y, et al. Fracture of a silicon nanowire at ultra-large elastic strain. Acta Mech, 2019, 230: 1441–1449

    Google Scholar 

  38. Godet J, Brochard S, Pizzagalli L, et al. Dislocation formation from a surface step in semiconductors: An ab initio study. Phys Rev B, 2006, 73: 092105

    Google Scholar 

  39. Green D J. An Introduction to the Mechanical Properties of Ceramics. Cambridge: Cambridge University Press, 1998

    Google Scholar 

  40. Wachtman J B, Cannon W R, Matthewson M J. Mechanical Properties of Ceramics. Hoboken: John Wiley & Sons, 2009

    Google Scholar 

  41. Pelleg J. Mechanical Properties of Ceramics. Berlin: Springer Science & Business, 2014

    Google Scholar 

  42. Hao S, Cui L, Jiang D, et al. A transforming metal nanocomposite with large elastic strain, low modulus, and high strength. Science, 2013, 339: 1191–1194

    Google Scholar 

  43. Mistry K, Armstrong M, Auth C, et al. Delaying forever: Uniaxial strained silicon transistors in a 90 nm CMOS technology. In: Digest of Technical Papers. 2004 Symposium on VLSI Technology. Honolulu, 2004. 50–51

  44. Steel F M, Turtle B R, Shen X, et al. Effects of strain on the electrical properties of silicon carbide. J Appl Phys, 2013, 114: 013702

    Google Scholar 

  45. Kuroiwa Y, Matsushita Y, Harada K, et al. Theoretical prediction of strain-induced carrier effective mass modulation in 4H-SiC and GaN. Appl Phys Lett, 2019, 115: 112102

    Google Scholar 

  46. Holzapfel W B. Physics of solids under strong compression. Rep Prog Phys, 1996, 59: 29–90

    Google Scholar 

  47. Osbourn G C. Strained-layer superlattices from lattice mismatched materials. J Appl Phys, 1982, 53: 1586–1589

    Google Scholar 

  48. Shi Z, Tsymbalov E, Dao M, et al. Deep elastic strain engineering of bandgap through machine learning. Proc Natl Acad Sci USA, 2019, 116: 4117–4122

    Google Scholar 

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Correspondence to Yang Lu.

Additional information

This work was supported by Hong Kong Research Grant Council (RGC) (Grant No. U11207416), City University of Hong Kong (Grant No. 7005234), and National Natural Science Foundation of China under the Excellent Young Scientists Fund (Grant No. 11922215).

Supplementary Information

Fig.S1

The fully recoverable loading-unloading compression straining of another single crystalline 4H-SiC pillar sample with same [0001] orientation. Four times loading-unloading tests are performed, and the fully recoverable elastic strain reaches up to 6.3%. The pillar finally failed with 6.6% fracture strain. The red solid lines indicated the compression amount by taking the indenter edge as the reference and red dash lines were used to calculate the conservative compressive strain.

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Supplementary material, approximately 233 KB.

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Fan, S., Li, X., Fan, R. et al. Compressive elastic behavior of single-crystalline 4H-silicon carbide (SiC) nanopillars. Sci. China Technol. Sci. 64, 37–43 (2021). https://doi.org/10.1007/s11431-020-1678-6

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  • DOI: https://doi.org/10.1007/s11431-020-1678-6

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