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Size- and temperature-dependent Young’s modulus and size-dependent thermal expansion coefficient of nanowires

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Abstract

Nanowires (NWs) exhibit size-dependent mechanical properties due to the high surface/volume ratio, in which temperature also plays an important role. The surface eigenstress model is further developed here to quantitatively predict the size-dependent mechanical properties of NWs and results in analytic formulas. Molecular dynamics (MD) simulations are conducted to study the size-dependent mechanical of [100], [110] and [111] Ni and Si nanowires within the temperature range of 100–400 K and the MD results verify perfectly the newly developed surface eigenstress model.

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Authors and Affiliations

  1. Materials Genome Institute, Shanghai University, and Shanghai Materials Genome Institute, Shanghai, 200444, China

    HongLiang Sun, LiuYan Chen, Sheng Sun & Tong-Yi Zhang

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  1. HongLiang Sun
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  2. LiuYan Chen
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  3. Sheng Sun
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  4. Tong-Yi Zhang
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Correspondence to Sheng Sun or Tong-Yi Zhang.

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Sun, H., Chen, L., Sun, S. et al. Size- and temperature-dependent Young’s modulus and size-dependent thermal expansion coefficient of nanowires. Sci. China Technol. Sci. 61, 687–698 (2018). https://doi.org/10.1007/s11431-018-9227-8

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  • DOI: https://doi.org/10.1007/s11431-018-9227-8

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