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A preliminary experimental validation of superposition strategy in thermal management of integrated circuit with multiple hot-spots

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Abstract

Thermal management is a key issue in the integrated circuit (IC) design. In this paper, the superposition strategy was experimentally validated using a modeling IC device, which was fabricated by laboratory-level microfabrication technique. Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device. The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations. With the help of the superposition strategy, thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually. The influence coefficients in the superposition strategy extracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.

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Authors and Affiliations

  1. Institute of Microelectronics, Peking University, Beijing, 100871, China

    Kun Liu, YuDan Pi, Wei Wang, ZhiHong Li, Jing Chen & YuFeng Jin

  2. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Beijing, 100871, China

    Wei Wang, ZhiHong Li, Jing Chen & YuFeng Jin

Authors
  1. Kun Liu
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  2. YuDan Pi
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  3. Wei Wang
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  4. ZhiHong Li
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  5. Jing Chen
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  6. YuFeng Jin
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Correspondence to Wei Wang.

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Liu, K., Pi, Y., Wang, W. et al. A preliminary experimental validation of superposition strategy in thermal management of integrated circuit with multiple hot-spots. Sci. China Technol. Sci. 57, 2138–2143 (2014). https://doi.org/10.1007/s11431-014-5645-7

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  • DOI: https://doi.org/10.1007/s11431-014-5645-7

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