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Thermal contact conductance estimation and experimental validation in hot stamping process

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Abstract

The variation in temperature of the blank would make major contribution to the mechanical properties of final component in hot stamping of ultra high strength steel (UHSS). It is important to use accurate thermal contact conductance (TCC) to carry out finite element simulation of hot stamping for reliable caculation results. In this paper, a flat compression test was performanced on a servo press. A fast response temperature measurement and data acquisition system was designed to obtain the temperature history of blank and die under different pressures. The thermal contact conductance between blank and die was got using an optimization algorithm. The error between the temperature curves using calculated thermal contact conductance and the curves of measurement temperature was analyzed. Result shows that reliable simulation results of temperature can be got through accurate thermal contact conductance.

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Authors and Affiliations

  1. State Key Laboratory of Material Processing and Die and Mould Technology, Huazhong University of Science & Technology, Wuhan, 430074, China

    Chao Wang, YiSheng Zhang, XiaoWei Tian, Bin Zhu & Jian Li

Authors
  1. Chao Wang
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  2. YiSheng Zhang
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  3. XiaoWei Tian
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  4. Bin Zhu
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  5. Jian Li
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Correspondence to YiSheng Zhang.

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Wang, C., Zhang, Y., Tian, X. et al. Thermal contact conductance estimation and experimental validation in hot stamping process. Sci. China Technol. Sci. 55, 1852–1857 (2012). https://doi.org/10.1007/s11431-012-4871-0

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  • DOI: https://doi.org/10.1007/s11431-012-4871-0

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