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Measurement of thermal boundary conductance between metal and dielectric materials using femtosecond laser transient thermoreflectance technique

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Abstract

The thermal boundary conductance of Al/SiO2, Al/Si, Au/SiO2, and Au/Si are measured by a femtosecond laser transient thermoreflectance technique. The distinct differences of the interfacial thermal conductance between these samples are observed. For the same metal film, the thermal boundary conductance between metal and substrate decreases with the thermal conductivity of the substrate. The measured results are explained with the phonon diffusion mismatch model by introducing a phonon transmission coefficient across the interface.

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Authors and Affiliations

  1. JiangSu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, School of Mechanical Engineering, Southeast University, Nanjing, 211189, China

    ChungWei Zhang, KeDong Bi, JianLi Wang, ZhongHua Ni & YunFei Chen

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  1. ChungWei Zhang
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  2. KeDong Bi
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  3. JianLi Wang
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  4. ZhongHua Ni
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  5. YunFei Chen
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Correspondence to ZhongHua Ni or YunFei Chen.

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Zhang, C., Bi, K., Wang, J. et al. Measurement of thermal boundary conductance between metal and dielectric materials using femtosecond laser transient thermoreflectance technique. Sci. China Technol. Sci. 55, 1044–1049 (2012). https://doi.org/10.1007/s11431-012-4754-4

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  • DOI: https://doi.org/10.1007/s11431-012-4754-4

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