Abstract
In-situ tensile testing in TEM (transmission electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. To facilitate in-situ TEM tensile tests of SCS (single crystal silicon) nanobeam, a MEMS tensile-testing chip was designed and fabricated. The chip was fabricated by means of bulk micromachining and wafer bonding techniques. An SCS nanobeam, a comb drive actuator, a force sensor beam and an electron beam window were integrated into the chip. With the on-chip comb-drive-actuator stretching the nanobeam and in-situ TEM observation, tensile test on a 90 nm-thick nanobeam was performed and the strain-stress relationship was obtained. The Young’s modulus was fitted to be 161 GPa and did not show the size effect.
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Supported by the National Basic Research (973 Program) (Grant No. 2006CB300406)
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Jin, Q., Wang, Y., Li, T. et al. A MEMS device for in-situ TEM test of SCS nanobeam. Sci. China Ser. E-Technol. Sci. 51, 1491–1496 (2008). https://doi.org/10.1007/s11431-008-0123-8
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DOI: https://doi.org/10.1007/s11431-008-0123-8