Experimental Mechanics

, Volume 54, Issue 4, pp 685–688 | Cite as

Microscale Fracture Toughness of Bismuth Doped Copper Bicrystals Using Double Edge Notched Microtensile Tests

  • M. J. McLeanEmail author
  • C. A. Wade
  • M. Watanabe
  • R. P. Vinci
Brief Technical Note


The availability of focused ion beam (FIB) milling, nanoindentation, and microelectromechanical systems (MEMS) based test platforms has enabled small-scale mechanical testing to become an increasingly popular approach for measuring material properties. While great emphasis has been placed on measuring plastic properties at the micro- and nanoscale [1, 2], an area that has received significantly less consideration is the measurement of fracture toughness. A technique for performing small-scale, in situ fracture toughness tests using double edge notched tensile (DENT) specimens has been developed and used to measure a nearly 40 % reduction in toughness associated with the addition of Bi to the grain boundary of a Cu bicrystal. That Bi embrittles Cu grain boundaries is well known [3, 4, 5, 6, 7, 8, 9, 10], however, as shown herein, the DENT technique offers certain advantages over existing boundary fracture tests, especially when used with ductile materials.


Small-scale mechanical testing Grain boundary embrittlement In-situ mechanical testing Fracture toughness testing 



The authors would like to acknowledge the financial support provided by NSF grant DMR-0804528. The digital image correlation software was provided by D. Read and N. Barbosa at NIST. The authors would also like to thank the engineers at Hysitron, Inc. for their help and support with the PI-85 system.


  1. 1.
    Uchic MD, Shade PA, Dimiduk DM (2009) Plasticity of micrometer-scale single crystals in compression. Annu Rev Mater Res 39:361–386CrossRefGoogle Scholar
  2. 2.
    Legros M, Gianola DS, Motz C (2010) Quantitative in situ mechanical testing in electron microscopes. MRS Bulletin 35:354–360CrossRefGoogle Scholar
  3. 3.
    Voce E, Hallowes APC (1947) The mechanism of the embrittlement of deoxidized copper by bismuth. J Inst Met 73:323–376Google Scholar
  4. 4.
    Joshi A, Stein DF (1971) An Auger spectroscopic analysis of bismuth segregated to grain boundaries in copper. J Inst Met 99:178–181Google Scholar
  5. 5.
    Hondros ED, McLean D (1974) Cohesive margin of copper. Phil Mag 29:771–795CrossRefGoogle Scholar
  6. 6.
    Russell JD, Winter AT (1985) Orientation effects in embrittlement of copper bicrystals by bismuth. Scripta Metall 19:575–579CrossRefGoogle Scholar
  7. 7.
    Chikwembani S, Weertman J (1989) Fatigue crack growth and fracture behavior of bismuth-doped copper bicrystals. Met Trans A 20A:1221–1231CrossRefGoogle Scholar
  8. 8.
    Li GH, Wu XJ, Cai M, Qiu Q, Tang QH (1990) A fractographic study of bismuth embrittlement of tilt boundaries in a copper bicrystal. Scripta Metall 24:2129–2134CrossRefGoogle Scholar
  9. 9.
    Wang JS, Anderson PM (1991) Fracture behavior of embrittled F.C.C. metal bicrystals. Acta Metall 39:779–792CrossRefGoogle Scholar
  10. 10.
    Li GH, Zhang LD (1995) Relationship between disorientation and bismuth induced embrittlement of [001] tilt boundary in copper bicrystal. Scripta Metall 32:1335–1340CrossRefGoogle Scholar
  11. 11.
    Harding DS, Oliver WC, Pharr GM (1995) Cracking during nanoindentation and its use in the measurement of fracture toughness. Mat Res Soc Symp Proc 356:663–668CrossRefGoogle Scholar
  12. 12.
    Chromik RR, Vinci RP, Allen SL, Notis MR (2003) Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints. J Mater Res 18:2251–2261CrossRefGoogle Scholar
  13. 13.
    Ichikawa Y, Maekawa S, Takashima K, Shimojo M, Higo Y, Swain MV (2000) Fracture behavior of micro-sized Ni-P amorphous alloy specimens. Mater Res Soc Symp Proc 605:273–278CrossRefGoogle Scholar
  14. 14.
    Di Maio D, Roberts SG (2005) Measuring fracture toughness of coatings using focused-ion-beam-machined Microbeams. J Mater Res 20:299–302CrossRefGoogle Scholar
  15. 15.
    Armstrong DEJ, Wilkinson AJ, Roberts SG (2009) Measuring local mechanical properties using FIB machined microcantilevers. Mater Res Soc Symp Proc 1185:1185-II02-08Google Scholar
  16. 16.
    Armstrong DEJ, Wilkinson AJ, Roberts SG (2011) Micro-mechanical measurements of fracture toughness of bismuth embrittled copper grain boundaries. Phil Mag Lett 91:394–400CrossRefGoogle Scholar
  17. 17.
    Kahn H, Ballarini R, Mullen RL, Heuer AH (1999) Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens. Proc R Soc Lond A 455:3807–3823CrossRefGoogle Scholar
  18. 18.
    Hosokawa H, Desai AV, Haque MA (2008) Plane stress fracture toughness of freestanding nanoscale thin films. Thin Solid Films 516:6444–6447CrossRefGoogle Scholar
  19. 19.
    Tada H, Paris PC, Irwin GR (2000) The stress analysis of cracks handbook, 3rd edn. ASME, New YorkCrossRefGoogle Scholar
  20. 20.
    Kang YL, Zhang ZF, Wang HW, Qin QH (2005) Experimental investigations of the effect of thickness on fracture toughness of metallic foils. Mater Sci Eng A 394:312–319CrossRefGoogle Scholar
  21. 21.
    Gruber PA, Arzt E, Spolenak R (2009) Brittle-to-ductile transition in ultrathin Ta/Cu film systems. J Mater Res 24:1906–1918CrossRefGoogle Scholar

Copyright information

© Society for Experimental Mechanics 2013

Authors and Affiliations

  • M. J. McLean
    • 1
    Email author
  • C. A. Wade
    • 1
  • M. Watanabe
    • 1
  • R. P. Vinci
    • 1
  1. 1.Lehigh UniversityBethlehemUSA

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