Abstract
In order to probe the mechanical response of microelectromechanical systems (MEMS) subjected to dynamic loading, a modified split Hopkinson pressure bar was used to load MEMS devices at accelerations ranging from 103–105 g. Multilayer beams consisting of a PZT film sandwiched between two metal electrodes atop an elastic layer of silicon dioxide were studied because of their relevance to active MEMS devices. Experiments were conducted using the modified split Hopkinson pressure bar to quantify the effects of dynamic loading amplitude, duration, and temporal profile on the failure of the multilayered cantilever beams. Companion finite element simulations of these beams, informed by experimental measurements, were conducted to shed light into the deformation of the multilayered beams. Results of the numerical simulations were then coupled with independent experimental measurements of failure stress in order to predict the material layer at which failure initiation occurred, and the associated time to failure. High-speed imaging was also used to capture the first real-time images of MEMS structures responding to dynamic loading and successfully compare the recorded failure event with those predicted numerically.
Similar content being viewed by others
References
Brantley WA (1973) Calculated elastic constants for stress problems associated with semiconductor devices. J Appl Physi 44(1):534–535
Brown TG, Davis B, Hepner D, Faust J, Meyers C, Muller P, Harkins T, Hollis M, Miller C, Placzankis B (2001) Strap-down microelectromechanical (MEMS) sensors for high-g munition applications. IEEE Trans Magn 37:336–342
Brown TG (2004) MEMS for diagnostic applications in harsh environments and developing munitions. ARO/MEMS Workshop, Arlington, VA
Duesterhaus MA, Bateman VI, Hoke DA (2004) Shock testing of MEMS devices, In: Proceedings of the 2004 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Costa Mesa, CA
Frew DJ, Forrestal MJ, Chen W (2002) Pulse shaping techniques for testing brittle materials with a split Hopkinson pressure bar. Exp Mech 42(1):93–106
Hallquist JO (1998) LS-DYNA theoretical manual. Livermore Software Technology Corporation, Livermore, California
Hopkinson B (1914) A method of measuring the pressure produced in the detonation of high explosives or by the impact of bullets. Philos Trans R Soc Lond Ser A 213:437–456
Jonnalagadda K, Chasiotis I, Lambros J, Polcawich R, Pulskamp J, Dubey M (2009) Experimental investigation of strain rate dependence in nanocrystalline Pt films, accepted in Experimental Mechanics. doi: 10.1007/s11340-008-9212-7
Kimberley J (2008) Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation, Ph.D. Thesis, University of Illinois at Urbana-Champaign.
Kimberley J, Chasiotis I, Lambros J (2008) Failure of microelectromechanical systems subjected to impulse loads. Int J Solids Struct 45:497–512
Kimberley J, Lambros J, Chasiotis I, Pulskamp J, Polcawich R, Dubey M (2009a) Mechanics of energy transfer and failure of ductile microscale beams subjected to dynamic loading, in revision, Journal of Mechanics and Physics of Solids
Kimberley J, Cooney RS, Lambros J, Chasiotis I, Barker NS (2009b) Failure of Au RF-MEMS switches subjected to dynamic loading, in revision, Sensors and Actuators A
Nieva PM, McGruer NE, Adams GG (2006) Air viscous damping effects in vibrating microbeams. In: Smart Structures and Materials 2006: Damping and Isolation, Proceedings of SPIE—The International Society for Optical Engineering, 6169: 61690 N
Polcawich RG, Pulskamp J, Judy D, Ranade P, Trolier-McKinstry S, Dubey M (2007) Surface micromachined microelectromechanical ohmic series switch using thin-film piezoelectric actuators. IEEE Trans Microw Theory Techn 55:2642–2654
Sharpe WN (2006) Mechanical properties of thin films for nano/micro electronics and devices. Presented at the ARL MICRA program review
Srikar VT, Senturia SD (2002) The reliability of microelectromechanical systems (MEMS) in shock environments. Journal of Microelectromechanical Systems 11(3):206–214
Wagner U, Franz J, Schweiker M, Bernhard W, Müller-Fiedler R, Michel B, Paul O (2001) Mechanical reliability of MEMS-structures under shock load. Microelectron Reliab 41:1657–1662
Yagnamurthy S, Chasiotis I, Lambros J, Polcawich R, Pulskamp J, Dubey M (2008) Mechanical properties of PZT films and their composites for RF-MEMS, 2008 Proceedings of the Society for Experimental Mechanics, Orlando, FL, June 1–5, 2008
Yagnamurthy S, Chasiotis I, Lambros J, Polcawich R, Pulskamp J, Dubey M (2009) Mechanical and piezoelectric properties of PZT films and their composites for RF-MEMS, to be submitted to Journal of Microelectromechanical Systems
Acknowledgments
The authors would like to acknowledge the support of the Army Research Office (ARO) under the Grant W911NF-05-1-0063 with Dr. Bruce LaMattina as the program manager, and the support by the National Science Foundation under Grant CMS-0555787. Electron microscopy was carried out in the Center for Microanalysis of Materials, University of Illinois, which is partially supported by the US Department of Energy under grant DEFG02-91-ER45439. The authors would also like to thank Richard Piekarz, John Conrad, and Joel Martin of the Army Research Laboratory along with Prashant Ranade of General Technical Services for their assistance in the fabrication of the MEMS devices.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Kimberley, J., Lambros, J., Chasiotis, I. et al. A Hybrid Experimental/Numerical Investigation of the Response of Multilayered MEMS Devices to Dynamic Loading. Exp Mech 50, 527–544 (2010). https://doi.org/10.1007/s11340-009-9259-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11340-009-9259-0