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Embedded Digital Speckle Pattern Interferometry for Three-dimensional Strain Analysis

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Abstract

The extension of Digital Speckle Pattern Interferometry to three-dimensional cases poses new challenges from both the practical and the theoretical points of view. In the present research, a scattering surface was created within a transparent Plexiglas specimen with the aid of atomized aluminum particles, and strain was measured in the interior plane. Test specimen configurations included a beam in bending and a disc in diametral compression. The tests on the beam in bending showed excellent agreement between Embedded DSPI results and resistance strain gages. However, for the disc in compression, large discrepancies were found. The main source of errors was identified in the effect of the refractive index gradient. Based on the assumption that the index of refraction changes proportionally to the local dilatation, the error was calculated and the predicted results were ultimately in good agreement with the DSPI data. In conclusion, the Embedded DSPI technique was found to be a viable tool for direct experimental strain investigation of complex 3-D cases.

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References

  1. Cloud GL (1998) Optical methods of engineering analysis. Cambridge University Press, New York.

    Google Scholar 

  2. Durelli AJ, Riley WF (1956) Developments in the grid method of experimental stress analysis. SESA Proceedings 14:91–100.

    Google Scholar 

  3. Durelli AJ, Daniel IM (1961) A nondestructive three-dimensional stran-analysis method. Journal of Applied Mechanics, Trans ASME, Series E 28(83):83–86, March.

    Google Scholar 

  4. Bremond C, Durelli AJ (1981) Experimental analysis of displacements and shears at surfaces of contact. Exp Mech 21(3):105–110.

    Article  Google Scholar 

  5. Sciammarella CA, Chaing FP (1964) The Moiré method applied to three-dimensional elastic problem. Exp Mech 4(11):313–319.

    Article  Google Scholar 

  6. Theocaris PS, Davids N, Gillich W, Calvit HH (1967) The Moire method for the study of explosions. Exp Mech 7(5):202–210.

    Article  Google Scholar 

  7. Kerber RC, Whittier JS (1969) Moiré interferometry with embedded grids-effect of optical refraction. Exp Mech 9(5):203–209.

    Article  Google Scholar 

  8. Cloud GL, Paleebut S (1984) Surface and internal strain fields near coldworked holes obtained by a multiple embedded-grid Moiré method. Eng Fract Mech 19(2):375–381.

    Article  Google Scholar 

  9. Cloud GL, Paleebut S (1992) Surface and interior strain fields measured by multiple-embedded-grid Moiré and strain gages. Exp Mech 32(3):273–281.

    Article  Google Scholar 

  10. Germaneau A, Doumalin P, Duprè JC (2007) 3D strain field measurement by correlation of volume images using scattered light: recording of images and choice of marks. Strain 43:207–218.

    Article  Google Scholar 

  11. Jambunathan K, Wang LS, Dobbins BN, He SP (1995) Semi-automatic phase shift calibration using digital speckle pattern interferometry. Opt Laser Technol 27(3):145–151.

    Article  Google Scholar 

  12. Vrooman HA, Maas AM (1991) Image processing algorithms for the analysis of phase-shifted speckle interference patterns. Appl Opt 30(13):1636–1641.

    Article  Google Scholar 

  13. Hong SS, Lanza di Scalea F, Cloud GL (1998) Image processing algorithms for whole field strain measurement by ESPI. Proceedings of the Society for Experimental Mechanics 1998 Spring Conference, Houston, Texas.

  14. Restivo G, Cloud GL, Beaudry R, Raju B (2004) 3-D Strain fields using embedded DSPI: pilot study. Proceedings of the 2004 SEM X International Congress and Exposition on Experimental and Applied Mechanics, Soc. Exp. Mechanics, Costa Mesa, CA, USA (June).

  15. Restivo G, Cloud GL, Raju BB (2006) Reliability and precision of embedded DSPI for the measurement of interior strain fields. Proceedings of the 2006 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, Soc. Exp. Mech., St. Louis, MO (June).

  16. Waxler RM, Horowitz D, Feldman A (1979) Optical and physical parameters of Plexiglas 55 and Lexan. Appl Opt 18(1):101–104.

    Article  Google Scholar 

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Acknowledgments

Xuhui Zhao conducted some of the experiments described herein. The authors appreciate the support of the US Army Tank-Automotive Research Development and Engineering Center (TARDEC), Dr. B. Raju of TARDEC and Dr. D. Templeton of TARDEC.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Michigan State University, 2555 Engineering Building, East Lansing, MI, 48824, USA

    G. Restivo & G.L. Cloud (SEM member)

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  1. G. Restivo
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  2. G.L. Cloud
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Correspondence to G. Restivo.

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Restivo, G., Cloud, G. Embedded Digital Speckle Pattern Interferometry for Three-dimensional Strain Analysis. Exp Mech 48, 731–740 (2008). https://doi.org/10.1007/s11340-007-9116-y

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  • DOI: https://doi.org/10.1007/s11340-007-9116-y

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