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A Noninvasive, on Wafer Method to Determine the Intrinsic Stress of a Polymer Layer

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Abstract

The method described in this paper allows an investigator to determine the intrinsic stress of a polymer layer in a way that does not result in damage to devices or test structures. The method requires that a small area of the polymer be released from the substrate to form a diaphragm. The diaphragm is stimulated with acoustic white noise and the diaphragm movement is monitored with a laser vibrometer. The first few resonance frequencies of the diaphragm are obtained using a laser vibrometer and then those frequencies are used to calculate the membrane intrinsic bi-axial tension.

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Authors and Affiliations

  1. University of Louisville, 518 Moser Rd, Louisville, KY, 40223, USA

    J. Conklin

  2. Southwest Research Institute, P.O. Drawer, 28510, San Antonio, TX, 78228-0510, USA

    J. Helffrich

  3. University of Louisville, Lutz Hall, Room 442 Brook St. and Warnock Ave., Louisville, KY, 40292, USA

    R. Cohn

  4. University of Louisville, Lutz Hall, Room 444 Brook St. and Warnock Ave., Louisville, KY, 40292, USA

    K. Walsh

  5. University of Louisville, W.S. Speed, Room 213 Eastern Parkway, Louisville, KY, 40292, USA

    H. Cox

Authors
  1. J. Conklin
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  2. J. Helffrich
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  3. R. Cohn
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  4. K. Walsh
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  5. H. Cox
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Correspondence to J. Conklin.

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Conklin, J., Helffrich, J., Cohn, R. et al. A Noninvasive, on Wafer Method to Determine the Intrinsic Stress of a Polymer Layer. Exp Mech 46, 307–311 (2006). https://doi.org/10.1007/s11340-006-6415-7

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  • DOI: https://doi.org/10.1007/s11340-006-6415-7

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