Abstract
In this report, we provide a comparison of the thermal transition and wear mechanisms of the interfaces of multilayered silicon–germanium (SiGe) on Si sublayers. From wear experiments, we determined the inherent deformation modes of samples, in particular, the wear sliding and thermal stability characteristics. The pile-up effect we observed on each side of the wear zone at room temperature was greater than that of the sample that had been subjected to thermal treatment. The distribution of the elements Si and Ge depended on the annealing conditions; decreases in element densities in secondary ion mass spectrometry depth profiles revealed interdiffusion within the films. We conclude that thermal analysis not only produced misfit dislocation defects but also significantly wavy sliding arising from interface adhesion failure. Annealing at RT, 800, 900, and 1,000 °C resulted in coefficients of friction of 0.125, 0.95, 0.85, and 0.11, respectively. We employed dynamic-mode ex situ wear tests to determine the applicability of the brittle and ductile transitions and adhesive wear effect of the multilayer SiGe/Si systems.
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Acknowledgments
This study was supported by the National Science Council of Taiwan for financial support (Grant No. NSC NSC 101-2221-E-167-004) and National Chin-Yi University of Technology (NCUT11-REM-004: 2012.1.1–2012.10.31 and NCUT 12-REM-003: 2013.1.1–2013.10.31). We thank Professor Wei-Hung Yau (Department of Mechanical Engineering, Chin-Yi University of Technology, Taichung 400, Taiwan, ROC) and Dr. H. C. Wen (Department of Mechanical Engineering, National Chiao Tung University, Taiwan) for technical and sample support, and we also thank Professor Y. R. Jeng, (Department of Mechanical Engineering, National Chung Cheng University, Taiwan) for supporting SPM equipment used in this study.
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Lian, D. Thermal Failure of Multilayer SiGe/Si. Tribol Lett 52, 461–467 (2013). https://doi.org/10.1007/s11249-013-0229-4
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DOI: https://doi.org/10.1007/s11249-013-0229-4