The paper studies mechanisms of increasing the adhesive wear resistance of the copper specimens after the bombardment by the nitrogen ions, which are coupled with a counterbody and operate in inert atmosphere. It is shown that the increase in the wear resistance is complex and connected with such mechanisms as solid solution hardening, size reduction of copper grains, fine CuN3 particle formation, dislocation density growth, and internal microscopic stress generation in the specimen surface layer. As compared to the initial state of the copper specimen, the wear resistance and microhardness of the ion-modified specimen increase approximately by 4 and 2.6 times, respectively, at the ion irradiation fluence of 9·1017 cm2. Further increase in the fluence leads to the reduction in the wear resistance and microhardness due to the pore growth in the surface layer caused by the nitrogen ion implantation.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 9, pp. 72–79, September, 2020.
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Sergeev, V.P., Kalashnikov, M.P., Sungatulin, A.R. et al. Adhesive Wear of Copper Friction Pair in Inert Atmosphere Reduced by Nitrogen Ion Implantation. Russ Phys J 63, 1530–1537 (2021). https://doi.org/10.1007/s11182-021-02202-y
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DOI: https://doi.org/10.1007/s11182-021-02202-y