Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(m K) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 2, pp. 113–117, February, 2015.
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Lebedev, S.M., Gefle, O.S., Dneprovskii, S.N. et al. Thermophysical Properties of Polymer Materials with High Thermal Conductivity. Russ Phys J 58, 266–270 (2015). https://doi.org/10.1007/s11182-015-0491-z
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DOI: https://doi.org/10.1007/s11182-015-0491-z