Abstract
Using methods of electron microscopy, we have discovered that combined electroexplosive alloying of nickel with boron and copper gives rise to a multilayer structure. An outer amorphous crystalline layer incorporating 2–3 nm nickel-and copper-boride, oxide, and boride-oxide crystallites is formed on the alloyed surface. The intermediate (subsurface) layer 1–2 µm thick is made up of NiB 12 and Ni 4 B 3 crystallites 120–130 nm in size, with boron-and copper-oxide particles observed along the grain boundaries. The underlying thick layer exhibits a cellular Ni-Cu-B melt crystallization structure grading initially into a high-rate dendritic crystallization structure and then into a granular structure. The electroexplosive alloying process is found to bring into existence a high scalar dislocation-density substructure in nickel crystallites both in the alloyed zone and in the adjacent heat-affected zone.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 3, pp. 3–7, March 2007.
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Tsvirkun, O.A., Bagautdinov, A.Y., Ivanov, Y.F. et al. Phase composition and defect substructure of nickel alloyed with boron and copper by electric explosion of conductors. Russ Phys J 50, 199–203 (2007). https://doi.org/10.1007/s11182-007-0028-1
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DOI: https://doi.org/10.1007/s11182-007-0028-1